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高性能混和訊號式介面積體電路---子計畫III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(II)
高性能混和訊號式介面積體電路---子計畫III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(II)
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922215E009039.pdf
(254.22 KB)
Date
2003
Authors
吳重雨
CHUNG-YUWU
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https://www.grb.gov.tw/search/planDetail?id=873480&docId=167338
https://ir.lib.nycu.edu.tw/handle/11536/91848
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