PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
| dc.citation.patentcountry | USA | en_US |
| dc.citation.patentnumber | 20170040262 | en_US |
| dc.contributor.author | Chien-Chung Lin | en_US |
| dc.contributor.author | Hao-Chung Kuo | en_US |
| dc.contributor.author | Chin-Wei Sher | en_US |
| dc.contributor.author | Hau-Vei Han | en_US |
| dc.contributor.author | Kuo-Ju Chen | en_US |
| dc.contributor.author | Zong-Yi Tu | en_US |
| dc.contributor.author | Hsien-Hao Tu | en_US |
| dc.date.accessioned | 2019-04-11T05:42:30Z | |
| dc.date.available | 2019-04-11T05:42:30Z | |
| dc.date.issued | 2017-02-09 | en_US |
| dc.description.abstract | A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer. | en_US |
| dc.identifier.govdoc | H01L023/535 | en_US |
| dc.identifier.govdoc | H01L021/768 | en_US |
| dc.identifier.govdoc | H01L023/532 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/151251 | |
| dc.language.iso | en_US | en_US |
| dc.title | PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE | en_US |
| dc.type | Patents | en_US |