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Model based Sub-Resolution Assist Features Using an Inverse Lithography Method

dc.citation.volume7140en_US
dc.contributor.authorYu, Jue-Chinen_US
dc.contributor.authorYu, Peichenen_US
dc.contributor.authorChao, Hsueh-Yungen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.date.accessioned2014-12-08T15:44:57Z
dc.date.available2014-12-08T15:44:57Z
dc.date.issued2008en_US
dc.description.abstractThe conventional segment-based OPC approach has been applied successfully for many CMOS generations and is currently favored. However, Inverse lithography technology (ILT) is a promising candidate for next-generation optical proximity correction (OPC). Still, there are issues that need to be thoroughly addressed and further optimized. In this work, we propose a model-based pre-OPC flow where the sizing of drawn patterns and placement of surrounding sub-resolution assist features (SRAF) are simultaneously generated in a single iteration using an ILT method. The complex patterns can then be simplified for a conventional OPC solution.en_US
dc.identifier.doi10.1117/12.804678en_US
dc.identifier.isbn978-0-8194-7381-3en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.journalLITHOGRAPHY ASIA 2008en_US
dc.identifier.urihttp://dx.doi.org/10.1117/12.804678en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/30353
dc.identifier.wosnumberWOS:000289407400025
dc.language.isoen_USen_US
dc.subjectoptical proximity correctionen_US
dc.subjectinverse lithographyen_US
dc.subjectsub-resolution assist featuresen_US
dc.titleModel based Sub-Resolution Assist Features Using an Inverse Lithography Methoden_US
dc.typeArticleen_US

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