<link rel="stylesheet" href="styles.cf390c6bfbe7555f.css"> Skip to main content

高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究(III)

dc.contributor.author吳重雨en_US
dc.contributor.authorCHUNG-YUWUen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:39:28Z
dc.date.available2014-12-13T10:39:28Z
dc.date.issued2001en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC90-2215-E009-108zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=665814&docId=126402en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/96509
dc.language.isozh_TWen_US
dc.subject電路設計zh_TW
dc.subject射頻收發機zh_TW
dc.subject互補式金氧半導體zh_TW
dc.subjectCircuit designen_US
dc.subjectRF transceiveren_US
dc.subjectCMOSen_US
dc.title高性混合訊號式發收機積體電路---子計畫I:互補式金氧半射頻發收機前置電路模組設計IP建立及應用研究(III)zh_TW
dc.titleThe Design of CMOS Front-end IC Modules and IP Cores for RF Transceivers in Various Applications(III)en_US
dc.typePlanen_US

Files

Original bundle

Now showing 1 - 2 of 2
Loading...
Thumbnail Image
Name:
902215E009108.pdf
Size:
381.38 KB
Format:
Adobe Portable Document Format
Loading...
Thumbnail Image
Name:
902215E009108.pdf
Size:
381.38 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: