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Investigation of the low dielectric siloxane-based hydrogen silsesquioxane (HSQ) as passivation layer on TFT-LCD

dc.citation.epage377en_US
dc.citation.issue2-4en_US
dc.citation.spage374en_US
dc.citation.volume516en_US
dc.contributor.authorChang, Ta-Shanen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorTsao, Shu-Weien_US
dc.contributor.authorYeh, Feng-Shengen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.date.accessioned2014-12-08T15:05:13Z
dc.date.available2014-12-08T15:05:13Z
dc.date.issued2007-12-03en_US
dc.description.abstractSpin-on low-k passivation is achieved on inverted-staggered back-channel-etched hydrogenated amorphous silicon thin-film transistors (TFT). The low-k passivation material, siloxane-based hydrogen silsesquioxane (HSQ), has been investigated for different process temperatures. Performance is improved with decreased temperature. At 300 degrees C, the TFT performance of HSQ passivation is superior to those of other TFTs. The hydrogen bonds of HSQ assist hydrogen incorporation to eliminate the density of states between the back channel and the passivation layer. The characteristics of HSQ passivated TFT have been studied in this work. (C) 2007 Published by Elsevier B.V.en_US
dc.identifier.doi10.1016/j.tsf.2007.08.014en_US
dc.identifier.issn0040-6090en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2007.08.014en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/3752
dc.identifier.wosnumberWOS:000252037500051
dc.language.isoen_USen_US
dc.subjectTFTen_US
dc.subjectpassivationen_US
dc.subjectlow-ken_US
dc.subjectHSQen_US
dc.titleInvestigation of the low dielectric siloxane-based hydrogen silsesquioxane (HSQ) as passivation layer on TFT-LCDen_US
dc.typeArticle; Proceedings Paperen_US

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