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發展超低溫銅接合與3DIC技術以實現40奈米與0.18微米異質整合平台及先進小尺寸石英震盪元件之研究
發展超低溫銅接合與3DIC技術以實現40奈米與0.18微米異質整合平台及先進小尺寸石英震盪元件之研究
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Date
2014
Authors
陳冠能
CHEN KUAN-NENG
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https://www.grb.gov.tw/search/planDetail?id=8348112&docId=444358
https://ir.lib.nycu.edu.tw/handle/11536/99979
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