高散熱鑽石複合基板
| dc.contributor.author | 吳耀銓 | zh_TW |
| dc.contributor.author | WU YEWCHUNG SERMON | en_US |
| dc.contributor.department | 國立交通大學材料科學與工程學系（所） | zh_TW |
| dc.date.accessioned | 2016-03-29T00:01:11Z | |
| dc.date.available | 2016-03-29T00:01:11Z | |
| dc.date.issued | 2016 | en_US |
| dc.description.sponsorship | 科技部 | zh_TW |
| dc.identifier.govdoc | MOST104-2221-E009-044-MY3 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=11706550&docId=475687 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/130895 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 高散熱鑽石複合基板 | zh_TW |
| dc.title | Diamond Compoite Substrate for Device Thermoangement | en_US |
| dc.type | Plan | en_US |
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