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應用於高密度資料儲存記憶體與電子突觸之BiCS 三維電阻式記憶體開發

dc.contributor.author侯拓宏en_US
dc.contributor.authorHou Tuo-Hungen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
dc.date.accessioned2014-12-13T10:41:49Z
dc.date.available2014-12-13T10:41:49Z
dc.date.issued2014en_US
dc.description.sponsorship科技部zh_TW
dc.identifier.govdocNSC102-2221-E009-188-MY3zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=8122256&docId=432831en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/98772
dc.language.isozh_TWen_US
dc.title應用於高密度資料儲存記憶體與電子突觸之BiCS 三維電阻式記憶體開發zh_TW
dc.titleBiCS 3D Rram Technology for High-Density Data-Storage Memory and Electronic Synapses Applicationsen_US
dc.typePlanen_US

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