應用於高密度資料儲存記憶體與電子突觸之BiCS 三維電阻式記憶體開發
| dc.contributor.author | 侯拓宏 | en_US |
| dc.contributor.author | Hou Tuo-Hung | en_US |
| dc.contributor.department | 國立交通大學電子工程學系及電子研究所 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:41:49Z | |
| dc.date.available | 2014-12-13T10:41:49Z | |
| dc.date.issued | 2014 | en_US |
| dc.description.sponsorship | 科技部 | zh_TW |
| dc.identifier.govdoc | NSC102-2221-E009-188-MY3 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=8122256&docId=432831 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/98772 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 應用於高密度資料儲存記憶體與電子突觸之BiCS 三維電阻式記憶體開發 | zh_TW |
| dc.title | BiCS 3D Rram Technology for High-Density Data-Storage Memory and Electronic Synapses Applications | en_US |
| dc.type | Plan | en_US |
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