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高性能混合訊號積體電路與系統之設計與研製---總計畫(III)

dc.contributor.author吳重雨en_US
dc.contributor.authorCHUNG-YUWUen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:37:19Z
dc.date.available2014-12-13T10:37:19Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-071zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=429199&docId=76829en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94542
dc.language.isozh_TWen_US
dc.subject混合信號積體電路zh_TW
dc.subject類神經網路zh_TW
dc.subject影像處理zh_TW
dc.subject無線電話zh_TW
dc.subject收發器積體電路zh_TW
dc.subject矽視網膜zh_TW
dc.subjectMixed-signal ICen_US
dc.subjectNeural networken_US
dc.subjectImage processingen_US
dc.subjectCordless telephoneen_US
dc.subjectTransceiver ICen_US
dc.subjectSilicon retinaen_US
dc.title高性能混合訊號積體電路與系統之設計與研製---總計畫(III)zh_TW
dc.titleThe Design and Implementation of High-Performance Mixed-Signal Integrated Cirucits and Systems (III)en_US
dc.typePlanen_US

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