高密度多層構裝基板與接合材料研究---總計畫

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Date

2000

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Keywords

電子構裝, 多層連線結構, 晶片接合, Electronic package, Multilayer interconnect structure, Chip connection

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https://www.grb.gov.tw/search/planDetail?id=541950&docId=99540
 https://ir.lib.nycu.edu.tw/handle/11536/93758

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研究計畫;;Research Plans

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