III-V高頻通訊積體電路及覆晶系統構裝(SPN)新製程發展計畫(II)
| dc.contributor.author | 張翼 | en_US |
| dc.contributor.department | 交通大學材料科學與工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:31:51Z | |
| dc.date.available | 2014-12-13T10:31:51Z | |
| dc.date.issued | 2004 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC93-2623-7009-016-IT | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=1048203&docId=199876 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/91176 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | III-V高頻通訊積體電路及覆晶系統構裝(SPN)新製程發展計畫(II) | zh_TW |
| dc.type | Plan | en_US |