銅與低介電材料介電層之系統整合及可靠度提升研究(II)
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 國立交通大學電子工程學系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:33:39Z | |
| dc.date.available | 2014-12-13T10:33:39Z | |
| dc.date.issued | 2003 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC92-2216-E009-005 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=828305&docId=156974 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/92183 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 銅與低介電材料介電層之系統整合及可靠度提升研究(II) | zh_TW |
| dc.title | The Reliability Enhancement for the Integrated System of Copper and Low K Dielectric Interconnect (II) | en_US |
| dc.type | Plan | en_US |