A small SiP module using LTCC 3D circuitry for dual band WLAN 802.11 a/b/g front-end solution

Abstract

Under the IEEE 802.11a/b/g WLAN specifications, this paper presents a dual-band RF FEM (Front-End Module) on LTCC substrate comprising two diplexers, two band-pass filters and two low-pass filters as a 802.11a/b/g SiP (System-in-Package) solution. To implement, a 5GHz LNA, dual-band DPDT (Double Pole, Double Throw) switch and power detector mounted on the surface of LTCC RF module are also integrated into the proposed module where has only 5.4mm x 4.0mm x 0.9mm in size. On the side of transmitter, the insertion losses of the simulated dual-band FEM are 0.7 and 0.6dB in 2.4-2.5 and 4.9-5.9GHz frequency bands, respectively. The maximum rejection characteristic is -30dB in the second and third harmonic bands. On the side of receiver, the insertion losses are 1.7 and 1.2dB in 2.4-2.5 and 4.9-5.9GHz bands, respectively. The maximum of both the isolation and rejection characteristics is -30dB.