STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20120268147 | zh_TW |
| dc.contributor.author | CHEN Chih | en_US |
| dc.contributor.author | Chang Yuan-Wei | en_US |
| dc.date.accessioned | 2014-12-16T06:15:05Z | |
| dc.date.available | 2014-12-16T06:15:05Z | |
| dc.date.issued | 2012-10-25 | en_US |
| dc.description.abstract | A structure for measuring bump resistance and a package substrate comprising the same are disclosed, the structure for measuring bump resistance of the present invention comprises: plural connecting bumps arranged in a row; at least one first connecting element; and at least one second connecting element; wherein the nth connecting bump and the (n+1)th connecting bump connect by the first connecting element, the (n+1)th connecting bump and the (n+2)th connecting bump connect by the second connecting element, n is an odd number of 1 or more; the first connecting element connects with a first voltage-measurement pad; the second connecting element connects with an auxiliary pad, the auxiliary pad connects with an auxiliary bump, a second voltage-measurement pad connects with the auxiliary bump. | zh_TW |
| dc.identifier.govdoc | G01R027/14 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105126 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME | zh_TW |
| dc.type | Patents | en_US |