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Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package

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dc.citation.epage18en_US
dc.citation.spage18en_US
dc.contributor.authorKo, Cheng-Taen_US
dc.contributor.authorYang, Kai-Mingen_US
dc.contributor.authorLin, Jim-Weinen_US
dc.contributor.authorWang, Chih-Lunen_US
dc.contributor.authorChou, Tzu-Chiehen_US
dc.contributor.authorYang, Yu-Taoen_US
dc.contributor.authorYu, Ting-Yangen_US
dc.contributor.authorChen, Yu-Huaen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.contributor.authorTseng, Tzyy-Jangen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2018-08-21T05:56:49Z
dc.date.available2018-08-21T05:56:49Z
dc.date.issued2017-01-01en_US
dc.description.abstractIn this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).en_US
dc.identifier.journal2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/146684
dc.identifier.wosnumberWOS:000404249700018en_US
dc.language.isoen_USen_US
dc.titleStudy on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Packageen_US
dc.typeProceedings Paperen_US

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