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毫米波高效率的固態元件陣列研究---子計畫一:毫米波固態元件之研究

dc.contributor.author李建平en_US
dc.contributor.authorLEE CHIEN-PINGen_US
dc.contributor.department國立交通大學電子工程學系zh_TW
dc.date.accessioned2014-12-13T10:39:09Z
dc.date.available2014-12-13T10:39:09Z
dc.date.issued1996en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC85-2215-E009-043zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=234745&docId=43100en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/96140
dc.language.isozh_TWen_US
dc.subject毫米波zh_TW
dc.subject共振穿透二極體zh_TW
dc.subject異質接面電晶體zh_TW
dc.subject格子網波導zh_TW
dc.subject原子層摻雜zh_TW
dc.subject翻轉式晶片zh_TW
dc.subjectMillimeter waveen_US
dc.subjectResonant tunneling diodeen_US
dc.subjectHeterojunction bipolar transistoren_US
dc.subjectGrid waveguideen_US
dc.subjectDelta dopingen_US
dc.subjectFlip-chipen_US
dc.title毫米波高效率的固態元件陣列研究---子計畫一:毫米波固態元件之研究zh_TW
dc.titleStudy of Millimeter Wave Solid State Devicesen_US
dc.typePlanen_US

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