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Annealing of defect states in reactive ion etched GaN

dc.citation.epage723en_US
dc.citation.issue2-3en_US
dc.citation.spage719en_US
dc.citation.volume69en_US
dc.contributor.authorLan, Wen-Howen_US
dc.contributor.authorHuang, Kuo-Chinen_US
dc.contributor.authorHuang, Kai Fengen_US
dc.contributor.authorLin, Jia-Chingen_US
dc.contributor.authorCheng, Yi-Chengen_US
dc.contributor.authorLin, Wen-Jenen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.date.accessioned2014-12-08T15:44:46Z
dc.date.available2014-12-08T15:44:46Z
dc.date.issued2008-02-01en_US
dc.description.abstractThe Al0.11Ga0.89N-based photodiodes fabricated under different annealing ambient after inductively Coupled plasma reactive ion etching process were studied. The dark current and photocurrent with different illuminated wavelengths were characterized. Higher photocurrent for the diode annealing in H-2 ambient can be observed and attributed to the defect-assisted photocurrent. This photocurrent shows a strong annealing ambient dependence and causes the shift of cutoff wavelength in the responsivity spectrum. The Surface state was characterized by the capacitance analysis with Schottky contact. (C) 2007 Elsevier Ltd. All rights reserved.en_US
dc.identifier.doi10.1016/j.jpcs.2007.07.068en_US
dc.identifier.issn0022-3697en_US
dc.identifier.journalJOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDSen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jpcs.2007.07.068en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/30220
dc.identifier.wosnumberWOS:000253874700099
dc.language.isoen_USen_US
dc.titleAnnealing of defect states in reactive ion etched GaNen_US
dc.typeArticle; Proceedings Paperen_US

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