Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects
| dc.contributor.author | Chen, K. N. | en_US |
| dc.contributor.author | Chang, Y. J. | en_US |
| dc.contributor.author | Ko, C. T. | en_US |
| dc.contributor.author | Hsu, S. Y. | en_US |
| dc.contributor.author | Chen, H. Y. | en_US |
| dc.contributor.author | Hsiao, C. | en_US |
| dc.contributor.author | Yu, T. H. | en_US |
| dc.contributor.author | Chen, Y. H. | en_US |
| dc.contributor.author | Lo, W. C. | en_US |
| dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
| dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
| dc.date.accessioned | 2014-12-08T15:28:41Z | |
| dc.date.available | 2014-12-08T15:28:41Z | |
| dc.date.issued | 2012 | en_US |
| dc.identifier.isbn | 978-1-4673-1137-3 | en_US |
| dc.identifier.journal | 2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/20752 | |
| dc.identifier.wosnumber | WOS:000312547500035 | |
| dc.language.iso | en_US | en_US |
| dc.title | Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects | en_US |
| dc.type | Proceedings Paper | en_US |
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