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助聽器晶片及系統---子計畫三:助聽器低功率數位電路及SoC整合(II)

dc.contributor.author周世傑en_US
dc.contributor.authorJOU SHYH-JYEen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
dc.date.accessioned2014-12-13T10:51:45Z
dc.date.available2014-12-13T10:51:45Z
dc.date.issued2008en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC97-2220-E009-020zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=1697150&docId=293279en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/102874
dc.language.isozh_TWen_US
dc.title助聽器晶片及系統---子計畫三:助聽器低功率數位電路及SoC整合(II)zh_TW
dc.titleUltra Low-Power Digital Circuits and SoC Integration for Hearing Aid(II)en_US
dc.typePlanen_US

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