高密度多層構裝基板與接合材料研究---子計畫III：新型低介電係數材料之製備及其性質研究(III)

dc.contributor.author	謝宗雍	en_US
dc.contributor.author	HSIEH TSUNG-EONG	en_US
dc.contributor.department	國立交通大學材料科學與工程學系	zh_TW
dc.date.accessioned	2014-12-13T10:39:49Z
dc.date.available	2014-12-13T10:39:49Z
dc.date.issued	2001	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC90-2216-E009-033	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=673266&docId=128266	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/96830
dc.language.iso	zh_TW	en_US
dc.subject	多層基板	zh_TW
dc.subject	低介電材料	zh_TW
dc.subject	製備	zh_TW
dc.subject	材料性質	zh_TW
dc.subject	高密度	zh_TW
dc.subject	Multilayer substrate	en_US
dc.subject	Low dielectric material	en_US
dc.subject	Preparation	en_US
dc.subject	Material property	en_US
dc.subject	High density	en_US
dc.title	高密度多層構裝基板與接合材料研究---子計畫III：新型低介電係數材料之製備及其性質研究(III)	zh_TW
dc.title	Prreparation of New Low Dielectric Constant Material and Study of Relevant Properties (III)	en_US
dc.type	Plan	en_US

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