利用氘化及氮化處理製備高可靠性薄閘氧化層深次微米NMOS元件

dc.contributor.author莊紹勳en_US
dc.contributor.authorChung Steve Sen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:49:26Z
dc.date.available2014-12-13T10:49:26Z
dc.date.issued2000en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC89-2215-E009-045zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=542146&docId=99594en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/101648
dc.language.isozh_TWen_US
dc.subject金氧半導體zh_TW
dc.subject熱載子可靠性zh_TW
dc.subject深次微米zh_TW
dc.subject界面特性化zh_TW
dc.subject氮化閘極氧化層zh_TW
dc.subject氘氣回火製程zh_TW
dc.subjectMOSen_US
dc.subjectHot carrier reliabilityen_US
dc.subjectDeep submicrometeren_US
dc.subjectInterface characterizationen_US
dc.subjectNitrided gate oxideen_US
dc.subjectDeuterium annealingen_US
dc.title利用氘化及氮化處理製備高可靠性薄閘氧化層深次微米NMOS元件zh_TW
dc.titleHighly Reliable Thin Gate Oxide Deep-Submicron N-MOSFET by Deuterium and Nitrogen Treatmentsen_US
dc.typePlanen_US

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