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THE NOVEL NONLINEAR DC RESPONSE OF AG THIN-FILMS DEPOSITED ON POROUS SILICON - A FRACTAL MODEL EXPLANATION

dc.citation.epage387en_US
dc.citation.issue1-3en_US
dc.citation.spage380en_US
dc.citation.volume221en_US
dc.contributor.authorYOUNG, TFen_US
dc.contributor.authorKUO, WCen_US
dc.contributor.authorJIANG, IMen_US
dc.contributor.authorCHANG, TCen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.department奈米中心zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.contributor.departmentNano Facility Centeren_US
dc.date.accessioned2014-12-08T15:03:04Z
dc.date.available2014-12-08T15:03:04Z
dc.date.issued1995-11-15en_US
dc.description.abstractWe have observed a novel non-linear de resistivity of Ag thin films deposited on porous silicon (PS) surfaces. We also found that as the porous silicon is oxidized in a HNO3 solution, the de resistivities of the Ag thin films become two orders of magnitude smaller, and behave linearly but are divided into three different regions. Each region exhibits different resistivities which drops abruptly at the thresholds. The resistivity decreases as the current increasing into a higher current region. The atomic force microscopy (AFM) image shows a self-affine structure of the PS surface with wires, hillocks and voids on various scales. After oxidation, the rough surface is smoothed down to simpler fractal hillock clusters. The silver clusters are deposited on the glazed surface in a fractal-like size distribution. A branched Koch curve fractal model is proposed in this study to model the tunneling between fractal-like silver clusters. It explains the stepwise linear fractal-like resistivity behavior.en_US
dc.identifier.issn0378-4371en_US
dc.identifier.journalPHYSICA Aen_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/1653
dc.identifier.wosnumberWOS:A1995TG78500038
dc.language.isoen_USen_US
dc.titleTHE NOVEL NONLINEAR DC RESPONSE OF AG THIN-FILMS DEPOSITED ON POROUS SILICON - A FRACTAL MODEL EXPLANATIONen_US
dc.typeArticle; Proceedings Paperen_US

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