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GreenArmy:綠色微雲伺服系統晶片平台技術-子計畫四:基於3D堆疊架構綠色微雲伺服系統晶片之電源與散熱管理研究(2/3)

dc.contributor.author曹孝櫟en_US
dc.contributor.authorTsao Shiao-Lien_US
dc.contributor.department國立交通大學資訊工程學系(所)zh_TW
dc.date.accessioned2014-12-13T10:41:36Z
dc.date.available2014-12-13T10:41:36Z
dc.date.issued2012en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC101-2220-E009-036zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2547436&docId=387258en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/98574
dc.language.isozh_TWen_US
dc.titleGreenArmy:綠色微雲伺服系統晶片平台技術-子計畫四:基於3D堆疊架構綠色微雲伺服系統晶片之電源與散熱管理研究(2/3)zh_TW
dc.titlePower and Thermal Management for 3D-stacked Cloudlet Server on Chipen_US
dc.typePlanen_US

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