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Memristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applications

dc.citation.epage863en_US
dc.citation.spage863en_US
dc.citation.woscount0en_US
dc.contributor.authorHudec, Borisen_US
dc.contributor.authorChang, Che-Chiaen_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.date.accessioned2019-04-02T06:04:27Z
dc.date.available2019-04-02T06:04:27Z
dc.date.issued2018-01-01en_US
dc.identifier.journal2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/151076
dc.identifier.wosnumberWOS:000458919700255en_US
dc.language.isoen_USen_US
dc.titleMemristive devices by ALD: design aspects for high density 3D arrays for memory and neuromorphic applicationsen_US
dc.typeProceedings Paperen_US

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