晶圓封裝打線製程之電腦視覺檢測與品質管制研究(II)

dc.contributor.author	彭德保	en_US
dc.contributor.author	PERNG DER-BAAU	en_US
dc.contributor.department	國立交通大學工業工程與管理學系	zh_TW
dc.date.accessioned	2014-12-13T10:31:34Z
dc.date.available	2014-12-13T10:31:34Z
dc.date.issued	2004	en_US
dc.description.sponsorship	行政院國家科學委員會	zh_TW
dc.identifier.govdoc	NSC93-2213-E009-038	zh_TW
dc.identifier.uri	https://www.grb.gov.tw/search/planDetail?id=1006893&docId=189744	en_US
dc.identifier.uri	https://ir.lib.nycu.edu.tw/handle/11536/91035
dc.language.iso	zh_TW	en_US
dc.title	晶圓封裝打線製程之電腦視覺檢測與品質管制研究(II)	zh_TW
dc.title	Vision Inspection and SPC Study for Wafer Wire-Bond Packaging (II)	en_US
dc.type	Plan	en_US

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