1 |
Performance comparison of titanium-oxide resistive switching memories using GeOx and AlOx capping layers for flexible application |
2014-06-01 |
2 |
Low-Voltage Steep Turn-On pMOSFET Using Ferroelectric High-kappa Gate Dielectric |
2014-02-01 |
3 |
Low-Leakage-Current DRAM-Like Memory Using a One-Transistor Ferroelectric MOSFET With a Hf-Based Gate Dielectric |
2014-01-01 |
4 |
Evolution of the conductivity type in germania by varying the stoichiometry |
2013-12-02 |
5 |
Gate-first n-MOSFET with a sub-0.6-nm EOT gate stack |
2013-09-01 |
6 |
Nano-crystallized titanium oxide resistive memory with uniform switching and long endurance |
2013-04-01 |
7 |
Evaluation of Temperature Stability of Trilayer Resistive Memories Using Work-Function Tuning |
2013-04-01 |
8 |
Achieving low sub-0.6-nm EOT in gate-first n-MOSFET with TiLaO/CeO2 gate stack |
2013-04-01 |
9 |
Ni/GeOx/TiOy/TaN RRAM on Flexible Substrate With Excellent Resistance Distribution |
2013-04-01 |
10 |
Metal-Gate/High-kappa/Ge nMOS at Small CET With Higher Mobility Than SiO2/Si at Wide Range Carrier Densities |
2013-02-01 |
11 |
Improved current distribution in resistive memory on flexible substrate using nitrogen-rich TaN electrode |
2012-12-10 |
12 |
Design of a CMOS T/R Switch With High Power Capability: Using Asymmetric Transistors |
2012-12-01 |
13 |
Ohmic contact on n-type Ge using Yb-germanide |
2012-11-26 |
14 |
A Dual-Resonant Mode 10/22-GHz VCO With a Novel Inductive Switching Approach |
2012-07-01 |
15 |
Highly uniform low-power resistive memory using nitrogen-doped tantalum pentoxide |
2012-07-01 |
16 |
Mechanism of GeO2 resistive switching based on the multi-phonon assisted tunneling between traps |
2012-06-11 |
17 |
A Bias-Varied Low-Power K-band VCO in 90 nm CMOS Technology |
2012-06-01 |
18 |
High-Performance GaN MOSFET With High-k LaAlO(3)/SiO(2) Gate Dielectric |
2012-01-01 |
19 |
High-Performance Charge-Trapping Flash Memory Device With an Ultrathin 2.5-nm Equivalent-Si(3)N(4)-Thickness Trapping Layer |
2012-01-01 |
20 |
Long-Endurance Nanocrystal TiO(2) Resistive Memory Using a TaON Buffer Layer |
2011-12-01 |
21 |
Unipolar Ni/GeOx/PbZr0.5Ti0.5O3/TaN Resistive Switching Memory |
2011-12-01 |
22 |
Bipolar conductivity in amorphous HfO(2) |
2011-08-15 |
23 |
Bipolar switching characteristics of low-power Geo resistive memory |
2011-08-01 |
24 |
Higher Gate Capacitance Ge n-MOSFETs Using Laser Annealing |
2011-04-01 |
25 |
Ultralow Switching Energy Ni/GeO(x)/HfON/TaN RRAM |
2011-03-01 |
26 |
Arsenic-Implanted HfON Charge-Trapping Flash Memory With Large Memory Window and Good Retention |
2011-03-01 |
27 |
Low-Power High-Performance Non-Volatile Memory on a Flexible Substrate with Excellent Endurance |
2011-02-15 |
28 |
Stacked GeO/SrTiO(x) Resistive Memory with Ultralow Resistance Currents |
2011-01-31 |
29 |
High-field mobility metal-gate/high-kappa Ge n-MOSFETs with small equivalent-oxide-thickness |
2011-01-01 |
30 |
High-Performance Gate-First Epitaxial Ge n-MOSFETs on Si With LaAlO(3) Gate Dielectrics |
2010-12-01 |
31 |
Highly scaled charge-trapping layer of ZrON nonvolatile memory device with good retention |
2010-11-22 |
32 |
Gate-First TaN/La(2)O(3)/SiO(2)/Ge n-MOSFETs Using Laser Annealing |
2010-11-01 |
33 |
Ultralow-Power Ni/GeO/STO/TaN Resistive Switching Memory |
2010-09-01 |
34 |
A Low-Power K-Band CMOS VCO With Four-Coil Transformer Feedback |
2010-08-01 |
35 |
Low-Voltage-Driven Flexible InGaZnO Thin-Film Transistor With Small Subthreshold Swing |
2010-07-01 |
36 |
Improved Capacitance Density and Reliability of High-k Ni/ZrO(2)/TiN MIM Capacitors Using Laser-Annealing Technique |
2010-07-01 |
37 |
Higher-kappa titanium dioxide incorporating LaAlO(3) as dielectrics for MIM capacitors |
2010-06-01 |
38 |
Design of Dual-Passband Microstrip Bandpass Filters With Multi-Spurious Suppression |
2010-04-01 |
39 |
A Nonvolatile InGaZnO Charge-Trapping-Engineered Flash Memory With Good Retention Characteristics |
2010-03-01 |
40 |
The Role of High-kappa TiHfO Gate Dielectric in Sputtered ZnO Thin-Film Transistors |
2010-01-01 |
41 |
High Performance of Ge nMOSFETs Using SiO(2) Interfacial Layer and TiLaO Gate Dielectric |
2010-01-01 |
42 |
Lanthanide-Oxides Mixed TiO(2) Dielectrics for High-kappa MIM Capacitors |
2010-01-01 |
43 |
High-kappa TiCeO MIM Capacitors with a Dual-Plasma Interface Treatment |
2010-01-01 |
44 |
A Study on Frequency-Dependent Voltage Nonlinearity of SrTiO(3) rf Capacitor |
2010-01-01 |
45 |
Characteristics of Cerium Oxide for Metal-Insulator-Metal Capacitors |
2010-01-01 |
46 |
A Low Operating Voltage ZnO Thin Film Transistor Using a High-kappa HfLaO Gate Dielectric |
2010-01-01 |
47 |
Radio Frequency Power Performance Enhancement for Asymmetric Lightly Doped Drain Metal-Oxide-Semiconductor Field-Effect Transistors on SiC Substrate |
2010-01-01 |
48 |
Improved Radio Frequency Power Characteristics of Complementary Metal-Oxide-Semiconductor-Compatible Asymmetric-Lightly-Doped-Drain Metal-Oxide-Semiconductor Transistor |
2010-01-01 |
49 |
Higher kappa Metal-Gate/High-kappa/Ge n-MOSFETs with < 1 nm EOT Using Laser Annealing |
2010-01-01 |
50 |
Highly-Scaled 3.6-nm ENT Trapping Layer MONOS Device with Good Retention and Endurance |
2010-01-01 |
51 |
Improved Stress Reliability of Analog Metal-Insulator-Metal Capacitors Using TiO(2)/ZrO(2) Dielectrics |
2009-12-01 |
52 |
High-Performance InGaZnO Thin-Film Transistors Using HfLaO Gate Dielectric |
2009-12-01 |
53 |
Interfacial layer dependence on device property of high-kappa TiLaO Ge/Si N-type metal-oxide-semiconductor capacitors at small equivalent-oxide thickness |
2009-11-23 |
54 |
Low-Threshold-Voltage TaN/LaTiO n-MOSFETs With Small EOT |
2009-09-01 |
55 |
Low-Threshold-Voltage MoN/HfAlO/SiON p-MOSFETs With 0.85-nm EOT |
2009-08-01 |
56 |
Effect of Ta(2)O(5) Doping on Electrical Characteristics of SrTiO(3) Metal-Insulator-Metal Capacitors |
2009-08-01 |
57 |
High-Density and Low-Leakage-Current MIM Capacitor Using Stacked TiO(2)/ZrO(2) Insulators |
2009-07-01 |
58 |
Low-Threshold-Voltage TaN/Ir/LaTiO p-MOSFETs Incorporating Low-Temperature-Formed Shallow Junctions |
2009-06-01 |
59 |
Small-Subthreshold-Swing and Low-Voltage Flexible Organic Thin-Film Transistors Which Use HfLaO as the Gate Dielectric |
2009-02-01 |
60 |
Low-V(t) TaN/HfLaO n-MOSFETs Using Low-Temperature Formed Source-Drain Junctions |
2009-01-01 |
61 |
Crucial integration of high work-function metal gate and high-k blocking oxide on charge-trapping type flash memory device |
2008-12-22 |
62 |
A flexible organic pentacene nonvolatile memory based on high-kappa dielectric layers |
2008-12-08 |
63 |
Improved RF Power Performance in a 0.18-mu m MOSFET Which Uses an Asymmetric Drain Design |
2008-12-01 |
64 |
Improvement of the performance of TiHfO MIM capacitors by using a dual plasma treatment of the lower electrode |
2008-10-01 |
65 |
Improving the retention and endurance characteristics of charge-trapping memory by using double quantum barriers |
2008-07-01 |
66 |
Comparison of MONOS memory device integrity when using Hf(1-x-y)N(x)O(y) trapping layers with different N compositions |
2008-06-01 |
67 |
New test structure to monitor contact-to-poly leakage in sub-90 nm CMOS technologies |
2008-05-01 |
68 |
Low subthreshold swing HfLaO/pentacene organic thin-film transistors |
2008-03-01 |
69 |
High-Performance MIM Capacitors Using a High-kappa TiZrO Dielectric |
2008-01-01 |
70 |
Low V-t gate-first Al/TaN/[Ir3Si-HfSi2-x]/HfLaON CMOS using simple laser annealing/reflection |
2008-01-01 |
71 |
HtLaON n-MOSFETs using a low work function HfSix gate |
2007-12-01 |
72 |
Improved high-temperature leakage in high-density MIM capacitors by using a TiLaO dielectric and an Ir electrode |
2007-12-01 |
73 |
Work function tunability of refractory metal nitrides by lanthanum or aluminum doping for advanced CMOS devices |
2007-11-01 |
74 |
Improved stress reliability of analog TiHfO metal-insulator-metal capacitors using high-work-function electrode |
2007-11-01 |
75 |
A program-erasable high-k Hf0.3N0.2O0.5 MIS capacitor with good retention |
2007-10-01 |
76 |
Use of a high-work-function ni electrode to improve the stress reliability of Analog SrTiO3 metal-insulator-metal capacitors |
2007-08-01 |
77 |
RF power performance of asymmetric-LDD MOS transistor for RF-CMOS SOC design |
2007-06-01 |
78 |
High-temperature stable HfLaON p-MOSFETs with high-work-function Ir3Si gate |
2007-04-01 |
79 |
Calibration 90 nm node RF mosfets, including stress degradation |
2007-03-01 |
80 |
High-temperature leakage improvement in metal-insulator-metal capacitors by work-function tuning |
2007-03-01 |
81 |
High-temperature stable IrxSi gates with high work function on HfSiON p-MOSFETs |
2007-02-01 |
82 |
Very low V(t) [Ir-Hf]/HfLaO CMOS using novel self-aligned low temperature shallow junctions |
2007-01-01 |
83 |
Thermal leakage improvement by using a high-work-function ni electrode in high-kappa TiHfO metal-insulator-metal capacitors |
2007-01-01 |
84 |
Very high density (44 fF/mu m(2)) SrTiO3 MIM capacitors for RF applications |
2007-01-01 |
85 |
Leakage current improvement of Ni/TiNiO/TaN metal-insulator-metal capacitors using optimized N+ plasma treatment and oxygen annealing |
2007-01-01 |
86 |
Electric stress effect on DC-RF performance degradation of 0.18-mu m mosfets |
2006-10-01 |
87 |
High-performance SrTiO3 MIM capacitors for analog applications |
2006-09-01 |
88 |
HfSiON n-MOSFETs using low-work function HfSi chi gate |
2006-09-01 |
89 |
RFIC TaN/SrTio(3)/TaN MIM capacitors with 35 fF/mu m(2) capacitance density |
2006-09-01 |
90 |
Strain enhanced DC-RF performance of 0.13 mu m nMOSFETs on flexible plastic substrate |
2006-07-06 |
91 |
HfAlON n-MOSFETs incorporating low-work function gate using ytterbium silicide |
2006-06-01 |
92 |
Electrical-stress effects and device modeling of 0.18-mu m RF MOSFETs |
2006-04-01 |
93 |
Study of parallel coupled-line microstrip filter in broadband |
2006-02-01 |
94 |
High work function IrxSi gates on HfAlON p-MOSFETs |
2006-02-01 |
95 |
Comparison of MiM performance with various electrodes and dieletric in Cu dual damascene of CMOS MS/RF technology |
2006-01-01 |
96 |
A quantum trap MONOS memory device using AlN |
2006-01-01 |
97 |
A parallel coupled-line filter using VLSI backend interconnect with high resistivity substrate |
2006-01-01 |
98 |
Very low noise RIF nMOSFETs on plastic by substrate thinning and wafer transfer |
2005-11-01 |
99 |
Very high-density (23 fF/mu m(2)) RF MIM capacitors using high-k TaTiO as the dielectric |
2005-10-01 |
100 |
Broad-spectrum light emission at microscopic breakdown sites in metal-insulator-silicon tunnel diodes |
2005-09-01 |
101 |
A fully planar microstrip coupled-line coupler with a high coupling level |
2005-07-20 |
102 |
Formation of dual-phase HfO2-HfxSi1-xO2 dielectric and its application in memory devices |
2005-07-01 |
103 |
Low noise RF MOSFETs on flexible plastic substrates |
2005-07-01 |
104 |
High-kappa Ir/TiTaO/TaN capacitors suitable for analog IC applications |
2005-07-01 |
105 |
High-performance poly-silicon TFTs incorporating LaAlO3 as the gate dielectric |
2005-06-01 |
106 |
The effect of IrO2-IrO2-Hf-LaAlO3 gate dielectric on the bias-temperature instability of 3-d GOI CMOSFETs |
2005-06-01 |
107 |
A novel program-erasable high-(K) A1N-Si MIS capacitor |
2005-03-01 |
108 |
Three-dimensional metal gate-high-kappa-GOI CMOSFETs on 1-poly-6-metal 0.18-mu m Si devices |
2005-02-01 |
109 |
Germanium pMOSFETs with Schottky-barrier germanide S/D, high-kappa gate dielectric and metal gate |
2005-02-01 |
110 |
The potential of functional scaling |
2005-01-01 |
111 |
Bias-temperature instability on fully silicided-germanided gates/high-k Al2O3CMOSFETs |
2005-01-01 |
112 |
Reducing AC power consumption by three-dimensional integration of Ge-on-insulator CMOS on 1-poly-6-metal 0.18 mu m Si MOSFETs |
2005-01-01 |
113 |
Low voltage lead titanate/Si one-transistor ferroelectric memory with good device characteristics |
2004-11-15 |
114 |
Alternative surface passivation on germanium for metal-oxide-semiconductor applications with high-k gate dielectric |
2004-11-01 |
115 |
High-performance bulk and thin-film microstrip transmission lines on VLSI-standard Si substrates |
2004-10-20 |
116 |
Electrical characteristics and suppressed boron penetration behavior of thermally stable HfTaO gate dielectrics with polycrystalline-silicon gate |
2004-10-04 |
117 |
High performance CPW and microstrip ring resonators on silicon substrates |
2004-09-20 |
118 |
Electron mobility in Ge and strained-Si channel ultrathin-body metal-oxide semi conductor field-effect transistors |
2004-09-20 |
119 |
A TaN-HfO2-Ge pMOSFET with novel SiH4 surface passivation |
2004-09-01 |
120 |
N-type Schottky barrier source/drain MOSFET using ytterbium silicide |
2004-08-01 |
121 |
RF, DC, and reliability characteristics of ALD HfO2-Al2O3 laminate MIM capacitors for Si RF IC applications |
2004-06-01 |
122 |
Effect of surface NH3 anneal on the physical and electrical properties of HfO2 films on Ge substrate |
2004-05-10 |
123 |
Schottky-barrier S/D MOSFETs with high-K gate dielectrics and metal-gate electrode |
2004-05-01 |
124 |
Al2O3-Ge-On-insulator n- and p-MOSFETs with fully NiSi and NiGe dual gates |
2004-03-01 |
125 |
Light emission near 1.3 mu m using ITO-Al2O3-Si0.3Ge0.7-Si tunnel diodes |
2004-01-01 |
126 |
High-density RF MIM capacitors using high-k La2O3 dielectrics |
2004-01-01 |
127 |
Device level characterization for energy bandgap of strain-relaxed SiGe and oxide/SiGe barrier height |
2004-01-01 |
128 |
The copper contamination effect of Al2O3 gate dielectric on Si |
2004-01-01 |
129 |
High-performance MIM capacitor using ALD high-k HfO2-Al2O3 laminate dielectrics |
2003-12-01 |
130 |
Fully silicided NiSi and germanided NiGe dual gates on SiO2 n- and p-MOSFETs |
2003-12-01 |
131 |
Integrated antennas on Si with over 100 GHz performance, fabricated using an optimized proton implantation process |
2003-11-01 |
132 |
Very high density RF MIM capacitors (17 fF/mu m(2) using high-kappa Al2O3 doped Ta2O5 dielectrics |
2003-10-01 |
133 |
High-performance microwave coplanar bandpass and bandstop filters on Si substrates |
2003-09-01 |
134 |
Lanthanide (Tb)-doped HfO2 for high-density MIM capacitors |
2003-07-01 |
135 |
PVD HfO2 for high-precision MIM capacitor applications |
2003-06-01 |
136 |
High-density MIM canpacitors using AlTaOx dielectrics |
2003-05-01 |
137 |
Fully silicided NiSi gate on La2O3 MOSFETs |
2003-05-01 |
138 |
Effect of Zr/Ti ratios on characterization of Pb(ZrxTi1-x)O-3 thin films on Al2O3 buffered Si for one-transistor memory applications |
2003-03-01 |
139 |
Electrical and structural characteristics of PbTiO3 thin films with ultra-thin Al2O3 buffer layers |
2003-02-17 |
140 |
A high-density MIM capacitor (13 fF/mu m(2)) using ALD HfO2 dielectrics |
2003-02-01 |
141 |
La2O3/Si0.3Ge0.7 p-MOSFETs with high hole mobility and good device characteristics |
2002-12-01 |
142 |
RF noise in 0.18-mu m and 0.13-mu m MOSFETs |
2002-12-01 |
143 |
40-GHz coplanar waveguide bandpass filters on silicon substrate |
2002-11-01 |
144 |
Formation of Ni germano-silicide on single crystalline Si0.3Ge0.7/Si |
2002-08-01 |
145 |
Poly-Si thin-film transistors crystallized by electron-beam annealing |
2002-07-01 |
146 |
RF noise characteristics of high-k AlTiOx and Al2O3 gate dielectrics |
2002-07-01 |
147 |
Investigation of inductively coupled plasma gate oxide on low temperature polycrystalline-silicon TFTs |
2002-06-01 |
148 |
Bi3.25La0.75Ti3O12 thin films on ultrathin Al2O3 buffered Si for ferroelectric memory application |
2002-04-29 |
149 |
High-density MIM capacitors using Al2O3 and AlTiOx dielectrics |
2002-04-01 |
150 |
Frequency-dependent capacitance reduction in high-k AlTiOx and Al2O3 gate dielectrics from IF to RF frequency range |
2002-04-01 |
151 |
Effect of annealing temperature on physical and electrical properties of Bi3.25La0.75Ti3O12 thin films on Al2O3-buffered Si |
2002-03-18 |
152 |
Characterization of Si/SiGe heterostructures on Si formed by solid phase reaction |
2002-03-01 |
153 |
Characteristics of Pb(Zr0.53Ti0.47)O-3 on metal and Al2O3/Si substrates |
2001-11-01 |
154 |
Cu contamination effect in oxynitride gate dielectrics |
2001-11-01 |
155 |
Effects of excimer laser dopant activation on low temperature polysilicon thin-film transistors with lightly doped drains |
2001-11-01 |
156 |
Stack gate PZT/Al2O3 one transistor ferroelectric memory |
2001-07-01 |
157 |
The strong degradation of 30 angstrom gate oxide integrity contaminated by copper |
2001-04-01 |
158 |
The effect of copper on gate oxide integrity |
2000-11-01 |
159 |
Fabrication of very high resistivity Si with low loss and cross talk |
2000-09-01 |
160 |
Electrical characteristics of high quality La2O3 gate dielectric with equivalent oxide thickness of 5 angstrom |
2000-07-01 |
161 |
High temperature formed SiGeP-MOSFET's with good device characteristics |
2000-07-01 |
162 |
The buried oxide properties in oxygen plasma-enhanced low-temperature wafer bonding |
2000-07-01 |
163 |
Thickness dependent gate oxide quality of thin thermal oxide grown on high temperature formed SiGe |
2000-06-01 |
164 |
High-quality thermal oxide grown on high-temperature-formed SiGe |
2000-05-01 |
165 |
Gate oxide integrity of thermal oxide grown on high temperature formed Si0.3Ge0.7 |
2000-03-01 |
166 |
Improved electrical characteristics of CoSi2 using HF-vapor pretreatment |
1999-07-01 |
167 |
The leakage current effect of thin gate oxides (2.4-2.7 nm) with in situ native oxide desorption |
1999-06-01 |
168 |
Improved electrical characteristics of CoSi2 using HF-vapor pretreatment |
1999-05-01 |
169 |
The effect of native oxide on epitaxial SiGe from deposited amorphous Ge on Si |
1999-01-25 |
170 |
The effect of native oxide on thin gate oxide integrity |
1998-11-01 |
171 |
Thin oxides with in situ native oxide removal |
1997-09-01 |
172 |
Ultrathin N2O-oxide with atomically flat interfaces |
1997-05-01 |
173 |
In0.52Al0.48As/InAs/InxAl1-xAs pseudomorphic HEMT's on InP |
1997-04-01 |
174 |
High quality epitaxial Si grown by a simple low pressure chemical vapor deposition at 550 degrees C |
1996-09-09 |
175 |
Picosecond photoresponse of carriers in Si ion-implanted Si |
1996-07-29 |
176 |
Observation of compositional modulation in (111)A InGaAs quantum wells and the effect on optical properties |
1996-07-22 |
177 |
Microstructure and subpicosecond photoresponse in GaAs grown by molecular beam epitaxy at very low temperatures |
1996-07-15 |
178 |
Enhancement of the optical and electrical properties in InGaAlP/InGaP PIN heterostructures by rapid thermal annealing on misoriented substrate |
1996-07-01 |
179 |
High quality Al(Ga)As/GaAs/Al(Ga)As quantum wells grown on (111)A GaAs substrates |
1996-06-10 |
180 |
Optical and structural properties of spontaneously formed long-range compositional modulation in (111)A and (111)B AlGaAs |
1996-06-01 |
181 |
Temperature-dependent transport properties of n(+) GaAs/low-temperature GaAs/n(+) GaAs structures grown by molecular beam epitaxy |
1996-06-01 |
182 |
High optical quality of strained (111)B In0.12Ga0.88As/GaAs and In0.12Ga0.88As/Al0.2Ga0.8As multiple quantum wells |
1996-05-06 |
183 |
SPONTANEOUSLY FORMED LONG-RANGE AL-RICH AND GA-RICH ALXGA1-XAS/ALYGA1-YAS SUPERLATTICE AND OPTICAL-PROPERTIES ENHANCEMENT IN (111)A ALGAAS |
1995-12-11 |
184 |
SPONTANEOUS FORMATION OF AL RICH AND GA RICH ALXGA1-XAS/ALYGA1-YAS SUPERLATTICE AND STRONG ENHANCEMENT OF OPTICAL-PROPERTIES |
1994-10-10 |
185 |
2-DIMENSIONAL ARSENIC PRECIPITATION BY IN DELTA-DOPING DURING LOW-TEMPERATURE MOLECULAR-BEAM EPITAXY GROWTH OF GAAS OR ALGAAS |
1994-05-09 |
186 |
STRONG ACCUMULATION OF AS PRECIPITATES IN LOW-TEMPERATURE INGAAS QUANTUM-WELLS GROWN BY MOLECULAR-BEAM EPITAXY |
1994-03-21 |
187 |
STRONG LUMINESCENCE INTENSITIES IN AL0.22GA0.78AS GROWN ON MISORIENTED (111)B GAAS |
1993-10-25 |
188 |
Bipolar conductivity in nanocrystallized TiO2 |
1970-01-01 |