國立交通大學機構典藏：研究人員|半導體材料與製程設備組|陳智

陳智 Chen, Chih

電子郵件／E-mail：chih@cc.nctu.edu.tw

服務單位／Department：工學院／半導體材料與製程設備組

著作期間／Publish Period：1970-01-01 - 2014-12-01

著作統計／Statistics

Article（173）

Books（1）

Digital Courses（1）

Others（8）

Patents（25）

Plan（30）

Proceedings Paper（42）

Thesis（100）

Article

序號 No.	標題 Title	著作日期 Date
1	Optimization of gefitinib analogues with potent anticancer activity	2014-11-15
2	Grain growth in electroplated (111)-oriented nanotwinned Cu	2014-10-15
3	A 4n-move self-stabilizing algorithm for the minimal dominating set problem using an unfair distributed daemon	2014-10-01
4	Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu	2014-08-19
5	Toward epitaxially grown two-dimensional crystal hetero-structures: Single and double MoS2/graphene hetero-structures by chemical vapor depositions	2014-08-18
6	Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing	2014-06-01
7	Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces	2014-05-01
8	Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization	2014-04-28
9	Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints	2014-02-28
10	CR108, a novel vitamin K3 derivative induces apoptosis and breast tumor inhibition by reactive oxygen species and mitochondrial dysfunction	2013-12-15
11	Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis	2013-09-21
12	Single-hidden-layer feed-forward quantum neural network based on Grover learning	2013-09-01
13	Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu	2013-08-01
14	Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints	2013-07-01
15	Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition	2013-05-08
16	Eliminate Kirkendall voids in solder reactions on nanotwinned copper	2013-03-01
17	Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy	2013-01-01
18	Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps	2013-01-01
19	Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging	2013-01-01
20	Effect of the surface-plasmon-exciton coupling and charge transfer process on the photoluminescence of metal-semiconductor nanostructures	2013-01-01
21	Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam	2012-12-01
22	Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints	2012-10-01
23	Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition	2012-10-01
24	Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish	2012-09-01
25	Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper	2012-05-25
26	Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging	2012-05-15
27	Thermomigration of Ti in flip-chip solder joints	2012-05-01
28	The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering	2012-05-01
29	Kinetic study of the intermetallic compound formation between eutectic Sn-3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints	2012-04-01
30	Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints	2012-02-15
31	Facile Fabrication of TiO(2) Nanorod Arrays for Gas Sensing using Double-Layered Anodic Oxidation Method	2012-01-01
32	Core-Shell Ni-NiO Nano Arrays for UV Photodetection without an External Bias	2012-01-01
33	The Differences in Optical Characteristics of TiO2 and TiO2/AAO Nanotube Arrays Fabricated by Atomic Layer Deposition	2012-01-01
34	Growth Mechanism of Self-Assembled TiO2 Nanorod Arrays on Si Substrates Fabricated by Ti Anodization	2012-01-01
35	The Effect of Geometric Structure on Photoluminescence Characteristics of 1-D TiO2 Nanotubes and 2-D TiO2 Films Fabricated by Atomic Layer Deposition	2012-01-01
36	Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow	2012-01-01
37	為環境信託開啟新視野：論私部門從事土地保育的法律工具類型	2012
38	Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu	2011-11-01
39	TiO(2-x) nanoparticles synthesized using He/Ar thermal plasma and their effectiveness on low-concentration mercury vapor removal	2011-10-01
40	Coupled microstructural and magnetic transition in Co-doped Ni nano-arrays	2011-10-01
41	Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices	2011-10-01
42	Magnetic properties of electroless-deposited Ni and Ni-NiO core-shell nano-arrays	2011-08-01
43	Magnetostructural phase transition in electroless-plated Ni nanoarrays	2011-06-01
44	Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints	2011-05-16
45	Constructing independent spanning trees for locally twisted cubes	2011-05-13
46	Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints	2011-04-01
47	7-Chloro-6-piperidin-1-yl-quinoline-5,8-dione (PT-262), a novel ROCK inhibitor blocks cytoskeleton function and cell migration	2011-04-01
48	Ultraviolet Photoresponse of TiO(2) Nanotube Arrays Fabricated by Atomic Layer Deposition	2011-01-01
49	Growth Mechanism of TiO(2) Nanotube Arrays in Nanopores of Anodic Aluminum Oxide on Si Substrates by Atomic Layer Deposition	2011-01-01
50	Ultrafast Initial Growth Rate of Self-Assembled TiO(2) Nanorod Arrays Fabricated by Ti Anodization	2011-01-01
51	Solution structure and phospho-PmrA recognition mode of PmrD from Klebsiella pneumoniae	2010-12-01
52	Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints	2010-10-01
53	Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization	2010-09-01
54	Covalent linkage of nanodiamond-paclitaxel for drug delivery and cancer therapy	2010-08-06
55	Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate	2010-07-01
56	Direct probe of heterojunction effects upon photoconductive properties of TiO(2) nanotubes fabricated by atomic layer deposition	2010-06-04
57	Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration	2010-05-01
58	All-to-all personalized exchange in generalized shuffle-exchange networks	2010-03-28
59	Fabrication and Characteristics of Self-Aligned ZnO Nanotube and Nanorod Arrays on Si Substrates by Atomic Layer Deposition	2010-01-01
60	Catalytic Behaviors in Modulating Enzymatic Activity through Different-sized Gold Nanoparticles	2010-01-01
61	Gate-to-drain capacitance verifying the continuous-wave green laser crystallization n-TFT trapped charges distribution under dc voltage stress	2009-12-21
62	Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints	2009-12-01
63	Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition	2009-10-14
64	Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs	2009-08-01
65	Video-assisted thoracoscopic surgery (VATS) for the treatment of hepatic hydrothorax: report of twelve cases	2009-07-01
66	Improved upper and lower bounds on the optimization of mixed chordal ring networks	2009-06-15
67	The Inductance Enhancement Study of Spiral Inductor Using Ni-AAO Nanocomposite Core	2009-05-01
68	Effect of bump size on current density and temperature distributions in flip-chip solder joints	2009-05-01
69	Thermomigration in Pb-free SnAg solder joint under alternating current stressing	2009-03-02
70	Chest wall abscess due to Prevotella bivia	2009-03-01
71	Electromigration in Sn-Cu intermetallic compounds	2009-01-15
72	Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy	2009-01-01
73	INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION	2009-01-01
74	Effects of electromigration on grain rotation behavior of SnAg solders	2009-01-01
75	Effect of Passivation Opening Design on Electromigration Reliability Issue in Flip-Chip Solder Joints	2009-01-01
76	Electrical characterization of fine-pitch compliant bumps	2009-01-01
77	Constructing independent spanning trees for hypercubes and locally twisted cubes	2009-01-01
78	Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration	2009-01-01
79	Optimal Design of Passivation/UBM Openings for Reducing Current Crowding Effect Under Electromigration of Flip-chip Solder Joint	2009-01-01
80	All-to-All Personalized Exchange Algorithms in Generalized Shuffle-exchange Networks	2009-01-01
81	In-situ Observation of the Failure Induced by Thermomigration of Interstitial Cu in Pb-free Flip Chip Solder Joints	2009-01-01
82	「胚胎植入前基因診斷」之憲法問題	2009
83	Magnetic bead-based DNA detection with multi-layers quantum dots labeling for rapid detection of Escherichia coli O157:H7	2008-12-01
84	Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints	2008-09-22
85	Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy	2008-08-01
86	Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration	2008-07-01
87	Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes	2008-07-01
88	Designating eukaryotic orthology via processed transcription units	2008-06-01
89	The effect of pre-aging on the electromigration of flip-chip SnAg solder joints	2008-06-01
90	Metal loaded zeolite adsorbents for phosphine removal	2008-03-05
91	Classification and medical diagnosis using wavelet-based fuzzy neural networks	2008-03-01
92	Enhanced green laser activation by antireflective gate structures in panel transistors	2008-02-11
93	Effect of polyethylene glycol additives on pulse electroplating of SnAg solder	2008-02-01
94	Hierarchical tensor approximation of multidimensional visual data	2008-01-01
95	Effect of plasma processing gas composition on the nitrogen-doping status and visible light photocatalysis of TiO2	2007-10-25
96	Relieving hot-spot temperature during electromigration in solder and current crowding effects bumps by using Cu columns	2007-10-01
97	Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure	2007-09-24
98	Enhanced hole mobility and reliability of panel epi-like silicon transistors using backside green laser activation	2007-09-01
99	Relieving Sn whisker growth driven by oxidation on Cu leadframe by annealing and reflowing treatments	2007-08-15
100	Preparation of N-doped TiO2 photocatalyst by atmospheric pressure plasma process for VOCs decomposition under UV and visible light sources	2007-06-01
101	An efficient code generation algorithm for non-orthogonal DSP architecture	2007-06-01
102	Node-pancyclicity and edge-pancyclicity of hypercube variants	2007-04-15
103	Thermomigration in flip-chip SnPb solder joints under alternating current stressing	2007-04-09
104	Study of B -> K-0(*)(1430)l(l)over-bar decays	2007-04-01
105	Fabrication of ordered Ta(2)O(5) nanodots using an anodic aluminum oxide template on Si substrate	2007-04-01
106	An effective and efficient code generation algorithm for uniform loops on non-orthogonal DSP architecture	2007-03-01
107	Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization	2007-03-01
108	Electromigration issues in lead-free solder joints	2007-03-01
109	Stress analysis of spontaneous Sn whisker growth	2007-03-01
110	Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints	2007-02-19
111	Stability of continuous-wave laser-crystallized epilike silicon transistors	2007-02-12
112	Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing	2007-02-01
113	Low-temperature growth of ZnO nanorods in anodic aluminum oxide on Si substrate by atomic layer deposition	2007-01-15
114	Effects of current crowding and Joule heating on reliability of solder joints	2007-01-01
115	Study of electromigration of flip-chip solder joints using Kelvin probes	2007-01-01
116	Continuous generation of TiO2 nanoparticles by an atmospheric pressure plasma-enhanced process	2007-01-01
117	Effects of supercritical fluids activation on carbon nanotube field emitters	2007-01-01
118	Fabrication of anodic aluminum oxide film on large-area glass substrate	2007-01-01
119	Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy	2006-12-25
120	Characterization and field-emission properties of carbon nanotube arrays in nanoporous alumina template and on blank Si substrate	2006-11-15
121	Hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallurgy layer	2006-11-01
122	Effect of al trace dimension on electromigration failure time of flip-chip solder joints	2006-09-01
123	An efficient algorithm to find a double-loop network that realizes a given L-shape	2006-08-14
124	Geometrical effect of bump resistance for flip-clip solder joints: Finite-element modeling and experimental results	2006-08-01
125	Study of electromigration in eutectic SnPb solder stripes using the edge displacement method	2006-08-01
126	Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes	2006-07-17
127	Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration	2006-07-10
128	Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization	2006-06-29
129	Trap-state density in continuous-wave laser-crystallized single-grainlike silicon transistors	2006-06-05
130	Critical length of electromigration for eutectic SnPb solder stripe	2006-05-01
131	Aging influence of poly(ethylene glycol) suppressors of Cu electrolytes on gaps filling	2006-05-01
132	Temperature and current-density distributions in flip-chip solder joints with Cu traces	2006-05-01
133	Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration	2006-04-24
134	Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes	2006-03-01
135	Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration	2006-01-09
136	Relieving the current crowding effect in flip-chip solder joints during current stressing	2006-01-01
137	Roles of additives in damascene copper electropolishing	2006-01-01
138	Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization	2005-10-01
139	Measurement of electromigration parameters of lead-free SnAg3.5 solder using U-groove lines	2005-10-01
140	Microstructural evolution during electromigration in eutectic SnAg solder bumps	2005-09-01
141	Electromigration in pb-free SnAg3.8Cu0.7 solder stripes	2005-08-01
142	Study of electromigration in thin tin film using edge displacement method	2005-07-01
143	Threshold current density of electromigration in eutectic SnPb solder	2005-05-16
144	A two-level scheduling method: an effective parallelizing technique for uniform nested loops on a DSP multiprocessor	2005-02-15
145	Two-additive electrolytes for superplanarizing damascene Cu metals	2005-01-01
146	Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow	2004-12-01
147	Thermal gradient in solder joints under electrical-current stressing	2004-11-01
148	Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr-Cu/Cu and Ni(P)/Au metallization pads	2004-10-15
149	Microstructure evolution during electromigration in eutectic SnPb solder bumps	2004-08-01
150	Tin whisker growth driven by electrical currents	2004-06-15
151	Electromigration at the high-Pb-eutectic SnPb solder interface	2004-02-01
152	Abnormal and regioselective Wacker oxidation of 1,5-dienes	2003-09-01
153	A release combined scheduling scheme for non-uniform dependence loops	2002-03-01
154	Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current	2001-12-10
155	Design of a scalable multiprocessor architecture and its simulation	2001-09-01
156	A complete fault diagnostic system for automated vehicles operating in a platoon	2001-07-01
157	Effects of construction on laterally loaded pile groups	2001-05-01
158	An optimized three region partitioning technique to maximize parallelism of nested loops with non-uniform dependences	2001-05-01
159	ODCHP: a new effective mechanism to maximize parallelism of nested loops with non-uniform dependences	2001-03-15
160	Enchanced linked-based cache coherence protocols with a hardware mechanism to reduce the migratory sharing overhead	2000-12-01
161	Lane changing with look-down reference systems on automated highways	2000-09-01
162	Lateral control of commercial heavy vehicles	2000-01-01
163	A fault-tolerant object service on CORBA	1999-11-01
164	New distributed arithmetic algorithm and its application to IDCT	1999-08-01
165	Grouping memory consistency model for parallel-multithreaded shared-memory multiprocessor systems	1999-03-01
166	A new relaxed memory consistency model for shared-memory multiprocessors with parallel-multithreaded processing elements	1998-12-01
167	A performance study of cache coherence protocols and write coaches for parallel-multithreaded shared-memory multiprocessors	1998-01-01
168	New program model for program partitioning on NUMA multiprocessor systems	1996-11-01
169	Exploiting communication complexity for Boolean matching	1996-10-01
170	A loop partition technique for reducing cache bank conflict in multithreaded architecture	1996-01-01
171	A PRECISION EXPERIMENT ON ELECTRONS, PHOTONS AND MUONS AT LHC	1993-02-01
172	A CLASS OF ADDITIVE MULTIPLICATIVE GRAPH FUNCTIONS	1987-05-01
173	The heterojunction effects of TiO2 nanotubes fabricated by atomic layer deposition on photocarrier transportation direction	1970-01-01

Books

序號 No.	標題 Title	著作日期 Date
1	國立交通大學材料科學與工程學系陳智教師升等送審資料論文集	2007

Digital Courses

序號 No.	標題 Title	著作日期 Date
1	材料科學與工程導論（一）	2010

Others

序號 No.	標題 Title	著作日期 Date
1	Crystal Structure of Dihydropyrimidinase from Tetraodon nigroviridis with Lysine Carboxylation: Metal Requirement for Post-translational Modification and Function	2014-03-01
2	SP-101, a novel gefitinib derivative induces apoptosis and tumor inhibition	2013-04-01
3	Thermomigration in solder joints	2012-09-01
4	Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints	2010-01-01
5	Haptoglobin 2-2 Phenotype Related To Plasma Decoy Receptor 3 Elevation Is Associated With Poor Outcomes In Patients With Acute Respiratory Distress Syndrome	2010-01-01
6	Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]	2007-06-11
7	Dynamics of nutritional health in older hospitalized patients in Taiwan	2005-10-01
8	Cross-reference maximum likelihood reconstruction for positron emission tomography with empiric studies	2001-08-01

Patents

序號 No.	標題 Title	著作日期 Date
1	一種電子顯微鏡樣品盒	2014-12-01
2	具有雙晶銅線路層之電路板及其製作方法	2014-10-01
3	電性連接結構及其製備方法	2014-08-16
4	一種電子顯微鏡樣品盒	2014-07-11
5	凸塊接點之電阻測量結構及包含其之封裝基板	2014-06-01
6	晶片電感結構及其製造方法	2014-05-21
7	具有雙晶銅線路層之電路板及其製作方法	2014-05-01
8	具有奈米雙晶銅之電性連接體、其製備方法、以及包含其之電性連接結構	2014-04-16
9	製造奈米結構材料的方法	2014-04-11
10	電鍍沉積之奈米雙晶銅金屬層及其製備方法	2014-04-01
11	用於減緩介金屬化合物成長之方法	2014-03-11
12	包含有具優選方向成長之Ｃｕ６Ｓｎ５晶粒之電性連接結構及其製備方法	2013-11-16
13	電鍍沉積之奈米雙晶銅金屬層及其製備方法	2013-06-01
14	用於減緩介金屬化合物成長之方法	2013-02-16
15	光感測元件及其製備方法	2013-01-16
16	一種電子顯微鏡樣品盒	2013-01-16
17	一種電子顯微鏡樣品盒	2013-01-16
18	凸塊接點之電阻測量結構及包含其之封裝基板	2012-11-01
19	電化學模具	2012-05-21
20	晶片電感結構及其製造方法	2011-03-01
21	ON-CHIP INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME	2011-02-24
22	製造奈米結構材料的方法	2009-07-16
23	電化學模具	2009-06-01
24	保護銲錫接點之方法及可降低銲錫接點中電遷移及焦耳熱效應之構造	2006-02-16
25	Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints	2006-02-09

Plan

序號 No.	標題 Title	著作日期 Date
1	3D IC 微凸塊電遷移研究	2014
2	新竹地區(交通大學)數學期刊圖書服務計畫	2014
3	無線感測網路的連接圖的二步著色問題	2014
4	<111>奈米雙晶銅墊層之銲錫接點的電遷移及界面冶金反應研究	2014
5	<111>奈米雙晶銅墊層之銲錫接點的電遷移及界面冶金反應研究	2013
6	3D IC 微凸塊電遷移研究	2013
7	3D IC 微凸塊電遷移研究	2012
8	以臨場穿透性電子顯微鏡研究通電導致之錫晶鬚成長及錫晶粒旋轉	2012
9	鋁導線的設計對覆晶銲錫電遷移的影響	2011
10	以臨場穿透性電子顯微鏡研究通電導致之錫晶鬚成長及錫晶粒旋轉	2011
11	以臨場穿透性電子顯微鏡研究通電導致之錫晶鬚成長及錫晶粒旋轉	2010
12	鋁導線的設計對覆晶銲錫電遷移的影響	2010
13	以電流驅動錫晶鬚的成長之研究	2009
14	鋁導線的設計對覆晶銲錫電遷移的影響	2009
15	厚膜UBM之覆晶銲錫接點電遷移及銲錫電遷移臨界長度之研究	2008
16	以電流驅動錫晶鬚的成長之研究	2008
17	厚膜UBM之覆晶銲錫接點電遷移及銲錫電遷移臨界長度之研究	2007
18	以電流驅動錫晶鬚的成長之研究	2007
19	覆晶銲錫接點電遷移孔洞生成機制之研究	2006
20	厚膜UBM之覆晶銲錫接點電遷移及銲錫電遷移臨界長度之研究	2006
21	ALD在Damascene銅製程應用之研究(III)	2005
22	電子產品軟焊焊點及界面之研究-覆晶銲錫接點之熱電效應及其抗電遷移之研究	2005
23	ALD 在 Damascene 銅製程應用之研究(II)	2004
24	以電子背散射繞射儀(EBSD)來研究錫膜的電遷移行為	2004
25	覆晶銲點性質變化與電流流動間交互之影響---子計畫二:以熱時效提升銲點之抗電遷移能力	2004
26	電流對無鉛銲料與其接點之影響---子計畫I：無鉛銲錫的電遷移研究(II)	2003
27	ALD在Damascene銅製程應用之研究	2002
28	電流對無鉛銲料與其接點之影響---子計畫I：無鉛銲錫的電遷移研究(I)	2002
29	無鉛銲錫的電遷移研究	2001
30	錫鉛銲錫合金的電子飄移研究	2000

Proceedings Paper

序號 No.	標題 Title	著作日期 Date
1	Necking of low-bump-height solder induced by reactive wetting of solder on Au finishes in print circuit board	2013-01-01
2	The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads	2012-01-01
3	Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature	2012-01-01
4	Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints	2010-11-01
5	Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow	2009-02-01
6	Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints	2009-01-01
7	Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure Design	2008-01-01
8	Effect of Passivation Opening on Electromigration in Eutectic SnPb Solder Joints	2008-01-01
9	Electrical characterization of fine-pitch compliant bumps	2008-01-01
10	Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy	2008-01-01
11	Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates	2008-01-01
12	Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder joints	2008-01-01
13	Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy	2008-01-01
14	Optimal all-to-all personalized exchange in d-nary banyan multistage interconnection networks	2007-10-01
15	Comparison of InGaAs MOSFETs with germanium-on-insulator CMOS	2006-08-01
16	Joule heating effect under accelerated electromigration in flip-chip solder joints	2006-01-01
17	Fast packet classification using bit compression	2005-01-01
18	Low voltage high speed SiO(2)/AlGaN/AlLaO(3)/TaN memory with good retention	2005-01-01
19	An effect scheme for fixed-length tunnel allocation in hierarchical WDM networks	2005-01-01
20	On the design of optical buffer for optical input-queued switches with quality of service guarantees	2005-01-01
21	DISCOUNT: A hybrid probability-based broadcast scheme for wireless ad hoc networks	2005-01-01
22	Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM	2005-01-01
23	Virtual topology reconfiguration in hierarchical cross-connect WDM networks	2005-01-01
24	3-D simulation on current density distribution in flip-cbip solder joints with thick CuUBM under current stressing	2005-01-01
25	Electromigration failure mechanism of Sn96.5Ag3.5 flip-chip solder bumps	2004-01-01
26	Nano silica removal from IC wastewater by pre-coagulation and microfiltration	2004-01-01
27	Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization	2003-11-01
28	Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization	2003-11-01
29	Tablet PC as a mobile PACS terminal using wireless LAN	2003-01-01
30	RF passive devices on Si with excellent performance close to ideal devices designed by electro-magnetic simulation	2003-01-01
31	Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology	2002-01-01
32	A practical nonblocking queue algorithm using compare-and-swap	2000-01-01
33	An optimized dependence convex hull partitioning technique to maximize parallelism of nested loops with non-uniform dependences	2000-01-01
34	Optimization of short channel effect by arsenic P-Halo implant through polysilicon gate for 0.12uw P-MOSFET	2000-01-01
35	Steering control of high speed vehicles: Dynamic look ahead and yaw rate feedback	1998-01-01
36	Effective parallelization techniques for non-uniform loops	1998-01-01
37	Look-ahead memory consistency model	1998-01-01
38	Effective mechanisms to reduce the overhead of migratory sharing for linked-based cache coherence protocols in clustering multiprocessor architecture	1998-01-01
39	A new scheduling strategy for NUMA multiprocessor systems	1996-01-01
40	A reinforcement learning control scheme for nonlinear systems with multiple actions	1996-01-01
41	OVERLAPPED DECOMPOSITIONS FOR COMMUNICATION COMPLEXITY DRIVEN MULTILEVEL LOGIC SYNTHESIS	1993-09-01
42	TECHNOLOGY MAPPING FOR FPGA USING GENERALIZED FUNCTIONAL DECOMPOSITION	1993-01-01

Thesis

序號 No.	標題 Title	著作日期 Date
1	TNAPL:三維積體電路針對矽穿孔雜訊改良的佈局擺置	2014
2	覆晶銲錫接點 Cu/SnAg/Ni/Cu與微凸塊接點 Cu/SnAg/Cu的電遷移研究	2014
3	小細胞雲端無線接取網路之合作式排程與仿真機制	2014
4	溫度循環試驗對晶圓級擴散型封裝之可靠度影響	2014
5	以控制銅錫介金屬化合物的晶體方向與形貌改善微電子封裝可靠度之研究	2013
6	在通電時錫晶粒方向與錫晶界對Cu6Sn5生成之影響	2013
7	覆晶封裝銲錫接點的電遷移與應力遷移行為之研究	2013
8	以凱文錫球結構及有限元素分析法研究覆晶銲錫凸塊與微凸塊的電遷移破壞機制	2013
9	以鎳為金屬墊層之覆晶錫銀銲錫接點於不同溫度下之電遷移失效模式研究	2013
10	不同溫度下5μm銅金屬墊層的覆晶錫銀銲錫凸塊之電遷移破壞模式研究	2013
11	具高度(111)優選方向之奈米雙晶銅膜之製備，熱穩定性及其在3D IC封裝的應用	2013
12	覆晶銲錫之電遷移研究: 溫度對破壞機制的影響與電阻曲線之分析	2013
13	臨場摻雜原子層沉積法成長P型氧化鋅薄膜	2013
14	低高度銲錫接點在高溫下生成多孔狀Cu3Sn介金屬化合物之研究	2013
15	奈米雙晶銅熱穩定性與其當作微凸塊金屬墊層在電遷移下的破壞模式研究	2013
16	三維積體電路之微凸塊電遷移可靠度議題研究	2013
17	以直流電製備奈米雙晶銅及其在3D IC 封裝之應用	2012
18	銅、鎳元素在迴銲測試中錫銀微凸塊銲錫內的熱遷移研究	2012
19	溫度變化對覆晶錫銀銲錫接點之電遷移破壞模式研究	2012
20	以凱文結構研究厚銅金屬墊層覆晶銲錫接點在電遷移測試下不同階段的破壞模式	2012
21	以錫銅化合物來抑止銲錫與銅多次回銲時Cu6Sn5的成長	2012
22	不同金屬墊層在低錫銀銲錫厚度下的電遷移破壞模式分析	2012
23	銲錫厚度對錫銀銲錫接點中電遷移效應的影響	2012
24	應用於無線傳感器網路之二步著色	2012
25	桃園縣公立高級中學學校組織氣氛與教師兼任行政職務意願影響因素之研究	2012
26	高深寬比TSV填銅製程與熱機械應力特性研究	2012
27	鈦金屬在TSV直通矽晶穿孔中的金屬薄膜覆蓋率研究	2011
28	臺北市國民中學教師對於教師工會之認知與參與意願	2011
29	不同錫銀銲錫厚度對Ni/SnAg/Cu微凸塊介面反應的影響	2011
30	覆晶錫銀銲錫接點於定溫不同電流密度下之電遷移失效模式研究	2011
31	陽極氧化鋁結構之介電溼潤應用	2011
32	不同金屬墊層結構對錫2.3銀微凸塊經熱循環測試後裂縫形成之研究	2011
33	我國大學提升教師教學專業發展策略之研究	2011
34	高級中等學校免試入學方案實施現況之研究---以桃園招生區為例	2011
35	以行銷理論探討陸生來台政策及陸生感受情形之研究	2011
36	主題產品與銷售之關係－以悠遊卡特製版為例	2011
37	覆晶封裝銲錫接點在介面反應，電遷移與熱遷移下之顯微結構變化	2010
38	利用陽極氧化鋁模板在矽基材上成長TixWyO的奈米結構材料	2010
39	50um CuNi/SnAg 金屬墊層覆晶銲錫凸塊之電遷移研究	2010
40	利用原子層沉積與陽極氧化鋁膜製備一維二氧化鈦奈米結構陣列及其光學特性研究	2010
41	一維鎳奈米柱，鎳-氧化鎳、鎳-二氧化鈦核殼奈米結構之製造與研究	2010
42	覆晶錫鉛銲錫以熱時效處理後之電遷移失效時間與微結構研究	2010
43	錫鉛覆晶銲錫中金屬墊層電遷移與熱遷移行為之研究	2010
44	錫銀覆晶銲錫中金屬墊層電遷移與熱遷移行為之研究	2010
45	三維積體電路封裝中錫2.5銀微凸塊的冶金反應之研究	2010
46	錫銀銲錫與不同厚度的銅鎳金屬層之冶金反應研究	2010
47	錫2.3銀微凸塊與銅金屬的冶金反應研究	2010
48	我國「發展國際一流大學及頂尖研究中心計畫」執行情況之研究	2010
49	鎳金屬墊層及SOP銅銲墊結構的共晶錫鉛銲錫接點之電遷移研究	2009
50	覆晶銲錫接點鎳墊層/錫銀銲錫/SOP製程銅銲墊結構的電遷移破壞模式之研究	2009
51	鋁導線設計對覆晶銲錫凸塊中的電流與溫度分佈之研究	2009
52	弦環式網路之全體對全體私有訊息傳送問題之研究	2009
53	Cu 5μm 與 Cu 5μm╱Ni 3μm 金屬墊層覆晶銲錫凸塊之電遷移研究	2009
54	針對錯誤修正碼記憶元件在早夭期失效率的新式計算方式之研究	2009
55	利用陽極氧化方式在石英基材上製備二氧化鈦奈米柱陣列	2009
56	一個用於無線網路中找出受限制的連通控制集的多項式時間近似演算法	2009
57	我國國民小學實習輔導教師遴選與獎勵措施之研究	2009
58	國民中小學教師罷教權之研究—全國教師會與全國家長團體聯盟之觀點	2009
59	覆晶共晶錫鉛銲錫接點 (5-um Cu 金屬墊層)之電遷移研究	2009
60	覆晶錫銀銲錫接點 (5-μm Cu 金屬墊層)之電遷移研究	2009
61	覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究	2009
62	在Baseline 網路和Omega 網路中設定排列的連線	2008
63	氮化矽層內嵌奈米矽晶體之SONOS型記憶體的分析	2008
64	S-DBR應用於不同環境下之影響	2008
65	覆晶封裝銲錫接點在電遷移效應下之熱與電特性	2008
66	高電場下金原子遷移造成之液晶顯示器驅動晶片失效之研究	2008
67	量測厚膜銅/鎳與銅金屬墊層的共晶錫鉛接點之電遷移活化能	2007
68	使用薄膜鈦/鎳(釩)/銅金屬墊層以及銅銲墊的錫銅銲錫接點之電遷移研究	2007
69	覆晶銲錫凸塊高度對無鉛銲錫電遷移破壞時間及破壞模式之影響	2007
70	連續波固態綠光雷射退火之面板型類磊晶矽電晶體	2007
71	使用在共晶錫鉛銲錫薄膜的電遷移效應研究複合式晶鬚之成長	2007
72	銲錫薄膜之電遷移與錫晶鬚生長之研究	2007
73	錫銀銅銲錫薄膜於電遷移效應下之研究	2006
74	利用氧化鋁膜為模板製備自組裝奈米結構於矽基材之研究	2006
75	焦耳熱效應對覆晶銲錫電遷移可靠度之影響	2006
76	銅連線中之線寬, 接點數目, 以及分析方法對電遷移平均壽命影響	2006
77	以凱文結構與三維模擬研究電遷移造成覆晶銲錫接點中孔洞的形成	2006
78	Chip-on-Glass（COG）彈性凸塊電性與可靠度之研究	2006
79	Sn-Cu介金屬化合物的電遷移	2006
80	銅電鍍與電解拋光於銅鑲嵌金屬連導線應用之研究	2005
81	覆晶封裝銲錫技術中熱時效對電遷移效應的影響	2005
82	原子層氣相沉積技術在低溫下於矽基材上成長ㄧ維氧化鋅奈米結構陣列與陽極氧化鋁處理製程於矽基材上成長零維氧化鉭奈米點陣列	2005
83	錫鉛焊錫接點在覆晶厚膜鎳/銅UBM結構上之電遷移	2005
84	錫銀銅無鉛銲錫電遷移之研究	2005
85	覆晶無鉛錫銀銲錫接點之電遷移破壞機制	2005
86	利用邊緣移動方法研究純錫薄膜之電遷移	2004
87	SnAg銲錫和不同厚度的電鍍Ni/Cu UBM 之界面反應研究	2004
88	用邊緣移動技術研究共晶銲錫之電遷移	2003
89	以Cu和Ni為電極的Sn3.5Ag無鉛銲錫線之電遷移的研究	2003
90	SnAgCuSb無鉛銲錫之界面反應及其電遷移特性研究	2003
91	共晶錫鉛銲錫於覆晶系統中之電遷移研究	2002
92	高鉛和共晶銲料之介面電遷移研究	2001
93	由電流驅使之錫晶鬚成長之研究	2001
94	具徑向雙折射液晶殼層光纖之溫度效應	1997
95	在分散式系統中的簡易啟發式多工配置方式	1995
96	平面可見圖及其性質之研究	1994
97	平面圖的點變樹分割及漢彌頓圈問題	1994
98	一個分解簡單多邊形為一致單調多邊形的演算法	1992
99	相交圖型的辨認問題	1992
100	沒有任何連通度為四的平面圖形是一個可見圖	1992

陳智 Chen, Chih

Article

Books

Digital Courses

Others

Patents

Plan

Proceedings Paper

Thesis

人文社會學院

工學院

生物科技學院

光電學院

客家文化學院

理學院

資訊學院

電機學院

管理學院

其他

科技法律學院