| 1 |
Ion-Bombarded and Plasma-Passivated Charge Storage Layer for SONOS-Type Nonvolatile Memory |
2014-09-01 |
| 2 |
Improvement in pH Sensitivity of Low-Temperature Polycrystalline-Silicon Thin-Film Transistor Sensors Using H-2 Sintering
|
2014-03-01 |
| 3 |
Characterization of Ultra-Thin Ni Silicide Film by Two-Step Low Temperature Microwave Anneal
|
2014-01-01 |
| 4 |
Novel Ion Bombardment Technique for Doping Limited Cu Source in SiOx-Based Nonvolatile Switching Layer
|
2013-11-01 |
| 5 |
High-Performance Double-Layer Nickel Nanocrystal Memory by Ion Bombardment Technique
|
2013-10-01 |
| 6 |
Improved Rear-Side Passivation by Atomic Layer Deposition Al2O3/SiNx Stack Layers for High V-OC Industrial p-Type Silicon Solar Cells
|
2013-09-01 |
| 7 |
Low-Temperature Polycrystalline-Silicon Tunneling Thin-Film Transistors With MILC
|
2013-08-01 |
| 8 |
Channel Thickness Effect on High-Frequency Performance of Poly-Si Thin-Film Transistors
|
2013-08-01 |
| 9 |
High-kappa Eu2O3 and Y2O3 Poly-Si Thin-Film Transistor Nonvolatile Memory Devices
|
2013-07-01 |
| 10 |
Enhancement of Open-Circuit Voltage Using CF4 Plasma Treatment on Nitric Acid Oxides
|
2013-05-01 |
| 11 |
Impacts of Multiple Strain-Gate Engineering on a Zero-Temperature-Coefficient Point
|
2013-04-01 |
| 12 |
High-Performance Polyimide-Based ReRAM for Nonvolatile Memory Application
|
2013-01-01 |
| 13 |
Microwave Annealing of Phosphorus and Cluster Carbon Implanted (100) and (110) Si
|
2013-01-01 |
| 14 |
Al-SiO2-Y2O3-SiO2-poly-Si Thin-Film Transistor Nonvolatile Memory Incorporating a Y2O3 Charge Trapping Layer
|
2013-01-01 |
| 15 |
Polycrystalline silicon thin-film transistor with nickel-titanium oxide by sol-gel spin-coating and nitrogen implantation
|
2012-12-01 |
| 16 |
Low-Operating-Voltage Ultrathin Junctionless Poly-Si Thin-Film Transistor Technology for RF Applications
|
2012-11-01 |
| 17 |
A Novel Ion-Bombarded and Plasma-Passivated Charge Storage Layer for SONOS-Type Nonvolatile Memory
|
2012-10-01 |
| 18 |
Reliability Analysis of Symmetric Vertical-Channel Nickel-Salicided Poly-Si Thin-Film Transistors
|
2012-08-01 |
| 19 |
Temperature Dependence of Electron Mobility on Strained nMOSFETs Fabricated by Strain-Gate Engineering
|
2012-07-01 |
| 20 |
Hydrogen Instability Induced by Postannealing on Poly-Si TFTs
|
2012-06-01 |
| 21 |
Novel 2-Bit/Cell Wrapped-Select-Gate SONOS TFT Memory Using Source-Side Injection for NOR-Type Flash Array
|
2012-06-01 |
| 22 |
Electrical and reliability characteristics of polycrystalline silicon thin-film transistors with high-kappa Eu2O3 gate dielectrics
|
2012-04-23 |
| 23 |
Robust Data Retention and Superior Endurance of Silicon-Oxide-Nitride-Oxide-Silicon-Type Nonvolatile Memory with NH3-Plasma-Treated and Pd-Nanocrystal-Embedded Charge Storage Layer
|
2012-04-01 |
| 24 |
High-Performance Poly-Si Thin-Film Transistors With L-Fin Channels
|
2012-02-01 |
| 25 |
Impacts of the Underlying Insulating Layers on the MILC Growth Length and Electrical Characteristics
|
2012-02-01 |
| 26 |
Susceptor Coupling for the Uniformity and Dopant Activation Efficiency in Implanted Si Under Fixed-Frequency Microwave Anneal
|
2012-02-01 |
| 27 |
Oxide Thinning and Structure Scaling Down Effect of Low-Temperature Poly-Si Thin-Film Transistors
|
2012-01-01 |
| 28 |
Simultaneous Activation and Crystallization by Low-Temperature Microwave Annealing for Improved Quality of Amorphous Silicon Thin-Film Transistors
|
2012-01-01 |
| 29 |
Effects of Channel Width and Nitride Passivation Layer on Electrical Characteristics of Polysilicon Thin-Film Transistors
|
2011-11-01 |
| 30 |
Symmetric Vertical-Channel Nickel-Salicided Poly-Si Thin-Film Transistors With Self-Aligned Oxide Overetching Structures
|
2011-07-01 |
| 31 |
Amorphous-Layer Regrowth and Activation of P and As Implanted Si by Low-Temperature Microwave Annealing
|
2011-07-01 |
| 32 |
Characterization of Enhanced Stress Memorization Technique on nMOSFETs by Multiple Strain-Gate Engineering
|
2011-04-01 |
| 33 |
Channel Film Thickness Effect of Low-Temperature Polycrystalline-Silicon Thin-Film Transistors
|
2011-04-01 |
| 34 |
Gate-All-Around Junctionless Transistors With Heavily Doped Polysilicon Nanowire Channels
|
2011-04-01 |
| 35 |
Fabrication of sub-100-nm metal-oxide-semiconductor field-effect transistors with asymmetrical source/drain using I-line double patterning technique
|
2011-03-01 |
| 36 |
Novel Sub-10-nm Gate-All-Around Si Nanowire Channel Poly-Si TFTs With Raised Source/Drain
|
2011-02-01 |
| 37 |
High Tensile Stress with Minimal Dopant Diffusion by Low Temperature Microwave Anneal |
2011-01-01 |
| 38 |
Fabrication and Characterization of High-k Dielectric Nickel Titanate Thin Films Using a Modified Sol-Gel Method
|
2011-01-01 |
| 39 |
High-Performance Poly-Si TFTs of Top-Gate with High-kappa Metal-Gate Combine the Laser Annealed Channel and Glass Substrate |
2011-01-01 |
| 40 |
Impact of Strain Layer on Gate Leakage and Interface-State for nMOSFETs Fabricated by Stress-Memorization Technique |
2011-01-01 |
| 41 |
Novel Symmetric Vertical-Channel Ni-Salicided Poly-Si Thin-Film Transistors With High ON/OFF-Current Ratio
|
2010-11-01 |
| 42 |
A Novel p-n-Diode Structure of SONOS-Type TFT NVM With Embedded Silicon Nanocrystals
|
2010-11-01 |
| 43 |
Formation and Structural Characterization of Cobalt Titanate Thin Films |
2010-10-01 |
| 44 |
The Zero-Temperature-Coefficient Point Modeling of DTMOS in CMOS Integration
|
2010-10-01 |
| 45 |
High-Reliability Dynamic-Threshold Source-Side Injection for 2-Bit/Cell With MLC Operation of Wrapped Select-Gate SONOS in NOR-Type Flash Memory
|
2010-09-01 |
| 46 |
Characteristics of SONOS-Type Flash Memory With In Situ Embedded Silicon Nanocrystals
|
2010-08-01 |
| 47 |
Nanoscale p-MOS Thin-Film Transistor With TiN Gate Electrode Fabricated by Low-Temperature Microwave Dopant Activation
|
2010-05-01 |
| 48 |
Benefit of NMOS by Compressive SiN as Stress Memorization Technique and Its Mechanism
|
2010-04-01 |
| 49 |
The Characteristics of n- and p-Channel Poly-Si Thin-Film Transistors with Fully Ni-Salicided S/D and Gate Structure
|
2010-01-01 |
| 50 |
Physical Mechanism of High-Programming-Efficiency Dynamic-Threshold Source-Side Injection in Wrapped-Select-Gate SONOS for NOR-Type Flash Memory
|
2009-11-01 |
| 51 |
MILC-TFT With High-kappa Dielectrics for One-Time-Programmable Memory Application
|
2009-09-01 |
| 52 |
High-performance p-channel LTPS-TFT using HfO(2) gate dielectric and nitrogen ion implantation |
2009-07-01 |
| 53 |
High-Speed Multilevel Wrapped-Select-Gate SONOS Memory Using a Novel Dynamic Threshold Source-Side-Injection (DTSSI) Programming Method
|
2009-06-01 |
| 54 |
Poly-Si Thin-Film Transistor Nonvolatile Memory Using Ge Nanocrystals as a Charge Trapping Layer Deposited by the Low-Pressure Chemical Vapor Deposition
|
2009-03-01 |
| 55 |
Vertical n-Channel Poly-Si Thin-Film Transistors With Symmetric S/D Fabricated by Ni-Silicide-Induced Lateral-Crystallization Technology
|
2009-03-01 |
| 56 |
Enhancement of Stress-Memorization Technique on nMOSFETs by Multiple Strain-Gate Engineering |
2009-01-01 |
| 57 |
Electrical Characteristics of High Performance SPC and MILC p-Channel LTPS-TFT with High-kappa Gate Dielectric |
2009-01-01 |
| 58 |
Characteristics of HfO(2)/Poly-Si Interfacial Layer on CMOS LTPS-TFTs With HfO(2) Gate Dielectric and O(2) Plasma Surface Treatment
|
2008-12-01 |
| 59 |
Positive Bias Temperature Instability (PBTI) Characteristics of Contact-Etch-Stop-Layer-Induced Local-Tensile-Strained HfO(2) nMOSFET |
2008-12-01 |
| 60 |
Impacts of N-2 and NH3 Plasma Surface Treatments on High-Performance LTPS-TFT With High-kappa Gate Dielectric
|
2008-11-01 |
| 61 |
High-program/erase-speed SONOS with in situ silicon nanocrystals
|
2008-10-01 |
| 62 |
X-ray photoelectron spectroscopy energy band alignment of spin-on CoTiO(3) high-k dielectric prepared by sol-gel spin coating method |
2008-09-01 |
| 63 |
Carrier transportation mechanism of the TaN/HfO(2)/IL/Si structure with silicon surface fluorine implantation
|
2008-07-01 |
| 64 |
SONOS memories with embedded silicon nanocrystals in nitride
|
2008-07-01 |
| 65 |
High-performance metal-induced laterally crystallized polycrystalline silicon p-channel thin-film transistor with TaN/HfO2 gate stack structure
|
2008-06-01 |
| 66 |
Reliability mechanisms of LTPS-TFT with HfO2 gate dielectric: PBTI, NBTI, and hot-carrier stress
|
2008-05-01 |
| 67 |
Impacts of fluorine ion implantation with low-temperature solid-phase crystallized activation on high-kappa LTPS-TFT
|
2008-02-01 |
| 68 |
Characteristics of PBTI and hot carrier stress for LTPS-TFT with high-kappa gate dielectric
|
2008-02-01 |
| 69 |
Current transport mechanism for HfO2 gate dielectrics with fluorine incorporation |
2008-01-01 |
| 70 |
Optimized ONO thickness for multi-level and 2-bit/cell operation for wrapped-select-gate (WSG) SONOS memory
|
2008-01-01 |
| 71 |
Performance and interface characterization for contact etch stop layer-strained nMOSFET with HfO2 gate dielectrics under pulsed-IV measurement |
2008-01-01 |
| 72 |
Performance enhancement by local strain in (110) channel n-channel metal-oxide-semicondiactor field-effect transistors on (111) substrate
|
2007-09-01 |
| 73 |
Characteristics of self-aligned Si/Ge T-gate poly-Si thin-film transistors with high ON/OFF current ratio
|
2007-05-01 |
| 74 |
Impact of channel dangling bonds on reliability characteristics of flash memory on poly-Si thin films
|
2007-04-01 |
| 75 |
Low-temperature polycrystalline silicon thin-film flash memory with hafnium silicate
|
2007-03-01 |
| 76 |
Systematical study of reliability issues in plasma-nitrided and thermally nitrided oxides for advanced dual-gate oxide p-channel metal-oxide-semiconductor field-effect transistors
|
2007-03-01 |
| 77 |
Highly reliable multilevel and 2-bit/cell operation of wrapped select gate (WSG) SONOS memory
|
2007-03-01 |
| 78 |
Impact of high-k offset spacer in 65-nm node SOI devices
|
2007-03-01 |
| 79 |
Performance enhancement for strained HfO(2) nMOSFET with contact etch stop layer (CESL) under pulsed-IV measurement |
2007-01-01 |
| 80 |
Performance improvement of CoTiO3 high-k dielectrics with nitrogen incorporation
|
2007-01-01 |
| 81 |
High-performance HfO2 gate dielectrics fluorinated by postdeposition CF4 plasma treatment
|
2007-01-01 |
| 82 |
Si nanocrystal memory devices self-assembled by in situ rapid thermal annealing of ultrathin a-Si on SiO2 |
2007-01-01 |
| 83 |
High-kappa material sidewall with source/drain-to-gate non-overlapped structure for low standby power applications
|
2006-11-01 |
| 84 |
The impact of deep Ni salicidation and NH3 plasma treatment on nano-SOI FinFETs
|
2006-10-01 |
| 85 |
Fringing electric field effect on 65-nm-node fully depleted silicon-on-insulator devices
|
2006-09-01 |
| 86 |
Improving electrical characteristics of high-k NiTiO dielectric with nitrogen ion implantation.
|
2006-09-01 |
| 87 |
Prospect of cobalt-mix-tetraethoxysilane method on localized lateral growth of carbon nanotubes for both p- and n-type field effect transistors
|
2006-09-01 |
| 88 |
Suppression of interfacial reaction for HfO2 on silicon by pre-CF4 plasma treatment
|
2006-08-14 |
| 89 |
A carbon nanotube field effect transistor with tunable conduction-type by electrostatic effects
|
2006-07-01 |
| 90 |
High-performance poly-Si TFTs with fully Ni-self-aligned silicided S/D and gate structure
|
2006-04-01 |
| 91 |
Crystal orientation and nitrogen effects on the carrier mobility of p-type metal oxide semiconductor field effect transistor with ultra thin gate dielectrics
|
2006-03-01 |
| 92 |
Complementary carbon nanotube-gated carbon nanotube thin-film transistor
|
2006-02-27 |
| 93 |
Reduction of donor-like interface traps of n-type metal-oxide-semiconductor field-effect-transistors using hydrogen-annealed wafer and in-situ HF-vapor treatment
|
2006-01-01 |
| 94 |
High voltage applications and NBTI effects of DT-pMOSFETS with reverse Schottky substrate contacts
|
2005-07-01 |
| 95 |
Mobility enhancement in local strain channel nMOSFETs by stacked a-Si/poly-Si gate and capping nitride |
2005-04-01 |
| 96 |
Effects of metallic contaminants on the electrical characteristics of ultrathin gate oxides |
2005-01-01 |
| 97 |
Localized lateral growth of single-walled carbon nanotubes for field-effect transistors by a cobalt-mix-TEOS method |
2005-01-01 |
| 98 |
CoTiO3 high-kappa, dielectrics on HSG for DRAM applications
|
2004-12-01 |
| 99 |
Suppression of boron penetration in P+-poly-SiGe gate p-channel metal-oxide-semiconductor field-effect transistor using NH3-nitrided and N2O-grown gate oxides
|
2004-11-01 |
| 100 |
Suppression of the floating-body effect in poly-Si thin-film transistors with self-aligned Schottky barrier source and ohmic body contact structure
|
2004-09-01 |
| 101 |
Mobility enhancement of MOSFETs on p-silicon (111) with in situ HF-Vapor. pre-gate oxide cleaning
|
2004-09-01 |
| 102 |
Novel one-step aqueous solutions to replace pregate oxide cleans
|
2004-08-01 |
| 103 |
Hot carrier degradations of dynamic threshold silicon on insulator p-type metal-oxide-semiconductor field effect transistors
|
2004-04-01 |
| 104 |
High-voltage and high-temperature applications of DTMOS with reverse Schottky barrier on substrate contacts
|
2004-02-01 |
| 105 |
Simultaneous quality improvement of tunneling- and interpoly-oxides of nonvolatile memory devices by NH3 and N2O nitridation
|
2003-11-01 |
| 106 |
The effects of dielectric type and thickness on the characteristics of dynamic threshold metal oxide semiconductor transistors
|
2003-09-01 |
| 107 |
A one-step single-cleaning solution for CMOS processes
|
2003-09-01 |
| 108 |
Ultrathin zirconium silicate films deposited on Si(100) using Zr(O(i)-Pr)(2)(thd)(2), Si(O(t)-Bu)(2)(thd)(2), and nitric oxide
|
2003-07-01 |
| 109 |
Structure and thermal stability of MOCVD ZrO2 films on Si (100)
|
2003-04-01 |
| 110 |
Effect of CF4 plasma pretreatment on low temperature oxides
|
2002-12-01 |
| 111 |
Impacts of gate structure on dynamic threshold SOI nMOSFETs
|
2002-08-01 |
| 112 |
Improvement of low-temperature gate dielectric formed in N2O plasma by an additional CF4 pretreatment process
|
2002-07-01 |
| 113 |
Ultra-shallow junction formation using implantation through capping nitride layer on source/drain extension
|
2002-07-01 |
| 114 |
Physical and electrical characterization of ZrO(2) gate insulators deposited on Si(100) using Zr(O(i)-Pr)(2)(thd)(2) and O(2) |
2002-06-01 |
| 115 |
Performance evaluation of cleaning solutions enhanced with tetraalkylammonium hydroxide substituents for post-CMP cleaning on poly-Si film
|
2002-06-01 |
| 116 |
Performance improvement of nickel salicided n-type metal oxide semiconductor field effect transistors by nitrogen implantation
|
2002-04-01 |
| 117 |
Reduction of nickel-silicided junction leakage by nitrogen ion implantation
|
2002-02-01 |
| 118 |
A practical implementation of parallel dynamic load balancing for adaptive computing in VLSI device simulation
|
2002-01-01 |
| 119 |
Nitrogen implantation and in situ HF vapor clean for deep submicrometer n-MOSFETs
|
2002-01-01 |
| 120 |
Comparison of novel cleaning solutions, with various chelating agents for post-CMP cleaning on poly-Si film
|
2001-11-01 |
| 121 |
Electrical characteristics of thin cerium oxide film on silicon substrate by reactive DC sputtering |
2001-09-01 |
| 122 |
Improved low temperature characteristics of p-channel MOSFETs with Si1-xGex raised source and drain
|
2001-08-01 |
| 123 |
High quality interpoly dielectrics deposited on the nitrided-polysilicon for nonvolatile memory devices
|
2001-07-01 |
| 124 |
X-ray photoelectron spectroscopy of gate-quality silicon oxynitride films produced by annealing plasma-nitrided Si(100) in nitrous oxide
|
2001-07-01 |
| 125 |
One-step cleaning solution to replace the conventional RCA two-step cleaning recipe for pregate oxide cleaning
|
2001-06-01 |
| 126 |
Electrical properties of shallow p(+)-n junction using boron-doped Si1-xGex layer deposited by ultrahigh vacuum chemical molecular epitaxy
|
2001-05-01 |
| 127 |
Characterization of ultrathin oxynitride (18-21 angstrom) gate dielectrics by NH3 nitridation and N2O RTA treatment
|
2001-05-01 |
| 128 |
Comparison of ultrathin CoTiO3 and NiTiO3 high-k gate dielectrics
|
2001-03-15 |
| 129 |
High-k cobalt-titanium oxide dielectrics formed by oxidation of sputtered Co/Ti or Ti/Co films
|
2001-03-05 |
| 130 |
Nano-oxidation of silicon nitride films with an atomic force microscope: Chemical mapping, kinetics, and applications
|
2001-02-15 |
| 131 |
High quality interpoly-oxynitride grown by NH3 nitridation and N2O RTA treatment
|
2001-02-01 |
| 132 |
The effects of super-steep-retrograde indium channel profile on deep submicron n-channel metal-oxide-semiconductor field-effect transistor
|
2001-01-01 |
| 133 |
High-performance and high-reliability 80-nm gate-length DTMOS with indium super steep retrograde channel
|
2000-12-01 |
| 134 |
Characteristics of TEOS polysilicon oxides: Improvement by CMP and high temperature RTA N-2/N2O annealing
|
2000-11-01 |
| 135 |
Optimum conditions for novel one-step cleaning method for pre-gate oxide cleaning using robust design methodology
|
2000-10-01 |
| 136 |
High quality ultrathin CoTiO3 high-k gate dielectrics |
2000-09-01 |
| 137 |
Reduced reverse narrow channel effect in thin SOI nMOSFETs
|
2000-09-01 |
| 138 |
An anomalous crossover in Vth roll-off for indium-doped nMOSFETs
|
2000-09-01 |
| 139 |
Plasma-process-induced damage in sputtered TiN metal-gate capacitors with ultrathin nitrided oxides
|
2000-08-01 |
| 140 |
Characteristics of polysilicon oxides combining N2O nitridation and CMP processes
|
2000-08-01 |
| 141 |
Robust ultrathin oxynitride dielectrics by NH3 nitridation and N2O RTA treatment
|
2000-08-01 |
| 142 |
Plasma-induced charging damage in ultrathin (3-nm) gate oxides
|
2000-07-01 |
| 143 |
Novel cleaning solutions for polysilicon film post chemical mechanical polishing
|
2000-07-01 |
| 144 |
Improvement of polysilicon oxide integrity using NF3-annealing
|
2000-06-15 |
| 145 |
Low contact resistance of poly-plug structure by in-situ HF-vapour cleaning
|
2000-04-13 |
| 146 |
High performance 0.1 mu m dynamic threshold MOSFET using indium channel implantation
|
2000-03-01 |
| 147 |
Nanometer-scale conversion of Si3N4 to SiOx
|
2000-01-17 |
| 148 |
The combined effects of nitrogen implantation at S/D extension and N2O oxide on 0.18 mu m N- and P-metal oxide field effect transistors (MOSFETs)
|
1999-12-01 |
| 149 |
Improvement of junction leakage of nickel silicided junction by a Ti-capping layer
|
1999-11-01 |
| 150 |
A novel Si-B diffusion source for p(+)-poly-Si gate
|
1999-10-01 |
| 151 |
A comprehensive study of hot carrier stress-induced drain leakage current degradation in thin-oxide n-MOSFET's
|
1999-09-01 |
| 152 |
Enhancement of integrity of polysilicon oxide by using a combination of N2O nitridation and CMP process
|
1999-05-01 |
| 153 |
The effects of shallow germanium halo doping on N-channel metal oxide semiconductor field effect transistors
|
1999-01-15 |
| 154 |
Improvement of reliability of metal-oxide semiconductor field-effect transistors with N2O nitrided gate oxide and N2O polysilicon gate reoxidation
|
1998-10-01 |
| 155 |
Improving radiation hardness of EEPROM/flash cell by N2O annealing
|
1998-07-01 |
| 156 |
Characterization of polysilicon oxides thermally grown and deposited on the polished polysilicon films
|
1998-04-01 |
| 157 |
Evaluation of plasma charging damage in ultrathin gate oxides
|
1998-03-01 |
| 158 |
Effects of N2O-annealed sacrificial oxide on the short-channel effects of nMOSFETs
|
1998-02-19 |
| 159 |
Suppression of boron penetration in p(+) polysilicon gate using Si-B diffusion source
|
1998-01-08 |
| 160 |
A study on the radiation hardness of flash cell with horn-shaped floating-gate
|
1997-09-01 |
| 161 |
Effects of floating-gate doping concentration on flash cell performance
|
1997-08-01 |
| 162 |
Improved flash cell performance by N2O annealing of interpoly oxide
|
1997-07-01 |
| 163 |
Suppression of boron penetration by using inductive-coupling-nitrogen-plasma in stacked amorphous/polysilicon gate structure
|
1997-06-19 |
| 164 |
A novel planarization of oxide-filled shallow-trench isolation
|
1997-01-01 |
| 165 |
Suppression of boron penetration in BF2+-implanted poly-Si gate
|
1996-12-01 |
| 166 |
Mechanism of nitrogen coimplant for suppressing boron penetration in p(+)-polycrystalline silicon gate of p metal-oxide semiconductor field effect transistor |
1996-09-16 |
| 167 |
Nitridization of the stacked poly-Si gate to suppress the boron penetration in pMOS
|
1996-07-01 |
| 168 |
POST-POLYSILICON GATE-PROCESS-INDUCED DEGRADATION ON THIN GATE OXIDE
|
1995-11-01 |
| 169 |
ELLIPSOMETRIC MEASUREMENTS AND ITS ALIGNMENT - USING THE INTENSITY RATIO TECHNIQUE
|
1995-09-01 |
| 170 |
EFFECTS OF POSTETCHING TREATMENTS ON ELECTRICAL CHARACTERISTICS OF THERMAL OXIDES ON REACTIVE-ION-ETCHED SILICON SUBSTRATES
|
1995-09-01 |
| 171 |
NITRIDATION OF THE STACKED POLY-SI GATE TO SUPPRESS THE BORON PENETRATION IN PMOS
|
1995-06-01 |
| 172 |
IMPROVEMENT OF THIN OXIDES THERMALLY GROWN ON THE REACTIVE-ION-ETCHED SILICON SUBSTRATES
|
1995-05-01 |
| 173 |
FOURIER-TRANSFORM INFRARED SPECTROSCOPIC STUDY OF OXIDE-FILMS GROWN IN PURE N2O
|
1995-05-01 |
| 174 |
THIN POLYOXIDE ON THE TOP OF POLY-SI GATE TO SUPPRESS BORON PENETRATION FOR PMOS
|
1995-05-01 |
| 175 |
INHIBITION OF BIRDS BEAK IN LOCOS BY NEW BUFFER N2O OXIDE
|
1995-02-16 |
| 176 |
MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY MEASUREMENT ON LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITED AMORPHOUS-SILICON AND POLYSILICON
|
1994-08-01 |
| 177 |
MEASUREMENT OF THIN OXIDE-FILMS ON IMPLANTED SI-SUBSTRATE BY ELLIPSOMETRY
|
1994-04-01 |
| 178 |
CHARACTERIZATIONS OF OXIDE GROWN BY N2O
|
1993-10-01 |
| 179 |
CHARACTERIZATION OF SEMIINSULATING POLYCRYSTALLINE SILICON PREPARED BY LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION
|
1993-09-01 |
| 180 |
THICKNESS DETERMINATION OF POLY-SI/POLY-OXIDE POLY-SI/SIO2/SI STRUCTURE BY ELLIPSOMETER
|
1993-06-24 |
| 181 |
THE REFRACTIVE-INDEX OF INP AND ITS OXIDE MEASURED BY MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY |
1993-05-15 |
| 182 |
A STUDY OF THE INTERFACIAL LAYER OF AL AND AL(1-PERCENT SI)-SI CONTACTS USING A ZERO-LAYER ELLIPSOMETRY MODEL |
1992-11-01 |
| 183 |
POLY-OXIDE POLY-SI/SIO2/SI STRUCTURE FOR ELLIPSOMETRY MEASUREMENT
|
1992-06-04 |
| 184 |
MEASUREMENT OF ULTRATHIN (LESS-THAN-100-A) OXIDE-FILMS BY MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY
|
1991-06-01 |
| 185 |
ELLIPSOMETRY MEASUREMENT OF THE COMPLEX REFRACTIVE-INDEX AND THICKNESS OF POLYSILICON THIN-FILMS
|
1990-02-01 |
| 186 |
Low-temperature poly-Si nanowire junctionless devices with gate-all-around TiN/Al2O3 stack structure using an implant-free technique
|
1970-01-01 |