1 |
Ion-Bombarded and Plasma-Passivated Charge Storage Layer for SONOS-Type Nonvolatile Memory |
2014-09-01 |
2 |
Improvement in pH Sensitivity of Low-Temperature Polycrystalline-Silicon Thin-Film Transistor Sensors Using H-2 Sintering |
2014-03-01 |
3 |
Characterization of Ultra-Thin Ni Silicide Film by Two-Step Low Temperature Microwave Anneal |
2014-01-01 |
4 |
Novel Ion Bombardment Technique for Doping Limited Cu Source in SiOx-Based Nonvolatile Switching Layer |
2013-11-01 |
5 |
High-Performance Double-Layer Nickel Nanocrystal Memory by Ion Bombardment Technique |
2013-10-01 |
6 |
Improved Rear-Side Passivation by Atomic Layer Deposition Al2O3/SiNx Stack Layers for High V-OC Industrial p-Type Silicon Solar Cells |
2013-09-01 |
7 |
Low-Temperature Polycrystalline-Silicon Tunneling Thin-Film Transistors With MILC |
2013-08-01 |
8 |
Channel Thickness Effect on High-Frequency Performance of Poly-Si Thin-Film Transistors |
2013-08-01 |
9 |
High-kappa Eu2O3 and Y2O3 Poly-Si Thin-Film Transistor Nonvolatile Memory Devices |
2013-07-01 |
10 |
Enhancement of Open-Circuit Voltage Using CF4 Plasma Treatment on Nitric Acid Oxides |
2013-05-01 |
11 |
Impacts of Multiple Strain-Gate Engineering on a Zero-Temperature-Coefficient Point |
2013-04-01 |
12 |
High-Performance Polyimide-Based ReRAM for Nonvolatile Memory Application |
2013-01-01 |
13 |
Microwave Annealing of Phosphorus and Cluster Carbon Implanted (100) and (110) Si |
2013-01-01 |
14 |
Al-SiO2-Y2O3-SiO2-poly-Si Thin-Film Transistor Nonvolatile Memory Incorporating a Y2O3 Charge Trapping Layer |
2013-01-01 |
15 |
Polycrystalline silicon thin-film transistor with nickel-titanium oxide by sol-gel spin-coating and nitrogen implantation |
2012-12-01 |
16 |
Low-Operating-Voltage Ultrathin Junctionless Poly-Si Thin-Film Transistor Technology for RF Applications |
2012-11-01 |
17 |
A Novel Ion-Bombarded and Plasma-Passivated Charge Storage Layer for SONOS-Type Nonvolatile Memory |
2012-10-01 |
18 |
Reliability Analysis of Symmetric Vertical-Channel Nickel-Salicided Poly-Si Thin-Film Transistors |
2012-08-01 |
19 |
Temperature Dependence of Electron Mobility on Strained nMOSFETs Fabricated by Strain-Gate Engineering |
2012-07-01 |
20 |
Hydrogen Instability Induced by Postannealing on Poly-Si TFTs |
2012-06-01 |
21 |
Novel 2-Bit/Cell Wrapped-Select-Gate SONOS TFT Memory Using Source-Side Injection for NOR-Type Flash Array |
2012-06-01 |
22 |
Electrical and reliability characteristics of polycrystalline silicon thin-film transistors with high-kappa Eu2O3 gate dielectrics |
2012-04-23 |
23 |
Robust Data Retention and Superior Endurance of Silicon-Oxide-Nitride-Oxide-Silicon-Type Nonvolatile Memory with NH3-Plasma-Treated and Pd-Nanocrystal-Embedded Charge Storage Layer |
2012-04-01 |
24 |
High-Performance Poly-Si Thin-Film Transistors With L-Fin Channels |
2012-02-01 |
25 |
Impacts of the Underlying Insulating Layers on the MILC Growth Length and Electrical Characteristics |
2012-02-01 |
26 |
Susceptor Coupling for the Uniformity and Dopant Activation Efficiency in Implanted Si Under Fixed-Frequency Microwave Anneal |
2012-02-01 |
27 |
Oxide Thinning and Structure Scaling Down Effect of Low-Temperature Poly-Si Thin-Film Transistors |
2012-01-01 |
28 |
Simultaneous Activation and Crystallization by Low-Temperature Microwave Annealing for Improved Quality of Amorphous Silicon Thin-Film Transistors |
2012-01-01 |
29 |
Effects of Channel Width and Nitride Passivation Layer on Electrical Characteristics of Polysilicon Thin-Film Transistors |
2011-11-01 |
30 |
Symmetric Vertical-Channel Nickel-Salicided Poly-Si Thin-Film Transistors With Self-Aligned Oxide Overetching Structures |
2011-07-01 |
31 |
Amorphous-Layer Regrowth and Activation of P and As Implanted Si by Low-Temperature Microwave Annealing |
2011-07-01 |
32 |
Characterization of Enhanced Stress Memorization Technique on nMOSFETs by Multiple Strain-Gate Engineering |
2011-04-01 |
33 |
Channel Film Thickness Effect of Low-Temperature Polycrystalline-Silicon Thin-Film Transistors |
2011-04-01 |
34 |
Gate-All-Around Junctionless Transistors With Heavily Doped Polysilicon Nanowire Channels |
2011-04-01 |
35 |
Fabrication of sub-100-nm metal-oxide-semiconductor field-effect transistors with asymmetrical source/drain using I-line double patterning technique |
2011-03-01 |
36 |
Novel Sub-10-nm Gate-All-Around Si Nanowire Channel Poly-Si TFTs With Raised Source/Drain |
2011-02-01 |
37 |
High Tensile Stress with Minimal Dopant Diffusion by Low Temperature Microwave Anneal |
2011-01-01 |
38 |
Fabrication and Characterization of High-k Dielectric Nickel Titanate Thin Films Using a Modified Sol-Gel Method |
2011-01-01 |
39 |
High-Performance Poly-Si TFTs of Top-Gate with High-kappa Metal-Gate Combine the Laser Annealed Channel and Glass Substrate |
2011-01-01 |
40 |
Impact of Strain Layer on Gate Leakage and Interface-State for nMOSFETs Fabricated by Stress-Memorization Technique |
2011-01-01 |
41 |
Novel Symmetric Vertical-Channel Ni-Salicided Poly-Si Thin-Film Transistors With High ON/OFF-Current Ratio |
2010-11-01 |
42 |
A Novel p-n-Diode Structure of SONOS-Type TFT NVM With Embedded Silicon Nanocrystals |
2010-11-01 |
43 |
Formation and Structural Characterization of Cobalt Titanate Thin Films |
2010-10-01 |
44 |
The Zero-Temperature-Coefficient Point Modeling of DTMOS in CMOS Integration |
2010-10-01 |
45 |
High-Reliability Dynamic-Threshold Source-Side Injection for 2-Bit/Cell With MLC Operation of Wrapped Select-Gate SONOS in NOR-Type Flash Memory |
2010-09-01 |
46 |
Characteristics of SONOS-Type Flash Memory With In Situ Embedded Silicon Nanocrystals |
2010-08-01 |
47 |
Nanoscale p-MOS Thin-Film Transistor With TiN Gate Electrode Fabricated by Low-Temperature Microwave Dopant Activation |
2010-05-01 |
48 |
Benefit of NMOS by Compressive SiN as Stress Memorization Technique and Its Mechanism |
2010-04-01 |
49 |
The Characteristics of n- and p-Channel Poly-Si Thin-Film Transistors with Fully Ni-Salicided S/D and Gate Structure |
2010-01-01 |
50 |
Physical Mechanism of High-Programming-Efficiency Dynamic-Threshold Source-Side Injection in Wrapped-Select-Gate SONOS for NOR-Type Flash Memory |
2009-11-01 |
51 |
MILC-TFT With High-kappa Dielectrics for One-Time-Programmable Memory Application |
2009-09-01 |
52 |
High-performance p-channel LTPS-TFT using HfO(2) gate dielectric and nitrogen ion implantation |
2009-07-01 |
53 |
High-Speed Multilevel Wrapped-Select-Gate SONOS Memory Using a Novel Dynamic Threshold Source-Side-Injection (DTSSI) Programming Method |
2009-06-01 |
54 |
Poly-Si Thin-Film Transistor Nonvolatile Memory Using Ge Nanocrystals as a Charge Trapping Layer Deposited by the Low-Pressure Chemical Vapor Deposition |
2009-03-01 |
55 |
Vertical n-Channel Poly-Si Thin-Film Transistors With Symmetric S/D Fabricated by Ni-Silicide-Induced Lateral-Crystallization Technology |
2009-03-01 |
56 |
Enhancement of Stress-Memorization Technique on nMOSFETs by Multiple Strain-Gate Engineering |
2009-01-01 |
57 |
Electrical Characteristics of High Performance SPC and MILC p-Channel LTPS-TFT with High-kappa Gate Dielectric |
2009-01-01 |
58 |
Characteristics of HfO(2)/Poly-Si Interfacial Layer on CMOS LTPS-TFTs With HfO(2) Gate Dielectric and O(2) Plasma Surface Treatment |
2008-12-01 |
59 |
Positive Bias Temperature Instability (PBTI) Characteristics of Contact-Etch-Stop-Layer-Induced Local-Tensile-Strained HfO(2) nMOSFET |
2008-12-01 |
60 |
Impacts of N-2 and NH3 Plasma Surface Treatments on High-Performance LTPS-TFT With High-kappa Gate Dielectric |
2008-11-01 |
61 |
High-program/erase-speed SONOS with in situ silicon nanocrystals |
2008-10-01 |
62 |
X-ray photoelectron spectroscopy energy band alignment of spin-on CoTiO(3) high-k dielectric prepared by sol-gel spin coating method |
2008-09-01 |
63 |
Carrier transportation mechanism of the TaN/HfO(2)/IL/Si structure with silicon surface fluorine implantation |
2008-07-01 |
64 |
SONOS memories with embedded silicon nanocrystals in nitride |
2008-07-01 |
65 |
High-performance metal-induced laterally crystallized polycrystalline silicon p-channel thin-film transistor with TaN/HfO2 gate stack structure |
2008-06-01 |
66 |
Reliability mechanisms of LTPS-TFT with HfO2 gate dielectric: PBTI, NBTI, and hot-carrier stress |
2008-05-01 |
67 |
Impacts of fluorine ion implantation with low-temperature solid-phase crystallized activation on high-kappa LTPS-TFT |
2008-02-01 |
68 |
Characteristics of PBTI and hot carrier stress for LTPS-TFT with high-kappa gate dielectric |
2008-02-01 |
69 |
Current transport mechanism for HfO2 gate dielectrics with fluorine incorporation |
2008-01-01 |
70 |
Optimized ONO thickness for multi-level and 2-bit/cell operation for wrapped-select-gate (WSG) SONOS memory |
2008-01-01 |
71 |
Performance and interface characterization for contact etch stop layer-strained nMOSFET with HfO2 gate dielectrics under pulsed-IV measurement |
2008-01-01 |
72 |
Performance enhancement by local strain in (110) channel n-channel metal-oxide-semicondiactor field-effect transistors on (111) substrate |
2007-09-01 |
73 |
Characteristics of self-aligned Si/Ge T-gate poly-Si thin-film transistors with high ON/OFF current ratio |
2007-05-01 |
74 |
Impact of channel dangling bonds on reliability characteristics of flash memory on poly-Si thin films |
2007-04-01 |
75 |
Low-temperature polycrystalline silicon thin-film flash memory with hafnium silicate |
2007-03-01 |
76 |
Systematical study of reliability issues in plasma-nitrided and thermally nitrided oxides for advanced dual-gate oxide p-channel metal-oxide-semiconductor field-effect transistors |
2007-03-01 |
77 |
Highly reliable multilevel and 2-bit/cell operation of wrapped select gate (WSG) SONOS memory |
2007-03-01 |
78 |
Impact of high-k offset spacer in 65-nm node SOI devices |
2007-03-01 |
79 |
Performance enhancement for strained HfO(2) nMOSFET with contact etch stop layer (CESL) under pulsed-IV measurement |
2007-01-01 |
80 |
Performance improvement of CoTiO3 high-k dielectrics with nitrogen incorporation |
2007-01-01 |
81 |
High-performance HfO2 gate dielectrics fluorinated by postdeposition CF4 plasma treatment |
2007-01-01 |
82 |
Si nanocrystal memory devices self-assembled by in situ rapid thermal annealing of ultrathin a-Si on SiO2 |
2007-01-01 |
83 |
High-kappa material sidewall with source/drain-to-gate non-overlapped structure for low standby power applications |
2006-11-01 |
84 |
The impact of deep Ni salicidation and NH3 plasma treatment on nano-SOI FinFETs |
2006-10-01 |
85 |
Fringing electric field effect on 65-nm-node fully depleted silicon-on-insulator devices |
2006-09-01 |
86 |
Improving electrical characteristics of high-k NiTiO dielectric with nitrogen ion implantation. |
2006-09-01 |
87 |
Prospect of cobalt-mix-tetraethoxysilane method on localized lateral growth of carbon nanotubes for both p- and n-type field effect transistors |
2006-09-01 |
88 |
Suppression of interfacial reaction for HfO2 on silicon by pre-CF4 plasma treatment |
2006-08-14 |
89 |
A carbon nanotube field effect transistor with tunable conduction-type by electrostatic effects |
2006-07-01 |
90 |
High-performance poly-Si TFTs with fully Ni-self-aligned silicided S/D and gate structure |
2006-04-01 |
91 |
Crystal orientation and nitrogen effects on the carrier mobility of p-type metal oxide semiconductor field effect transistor with ultra thin gate dielectrics |
2006-03-01 |
92 |
Complementary carbon nanotube-gated carbon nanotube thin-film transistor |
2006-02-27 |
93 |
Reduction of donor-like interface traps of n-type metal-oxide-semiconductor field-effect-transistors using hydrogen-annealed wafer and in-situ HF-vapor treatment |
2006-01-01 |
94 |
High voltage applications and NBTI effects of DT-pMOSFETS with reverse Schottky substrate contacts |
2005-07-01 |
95 |
Mobility enhancement in local strain channel nMOSFETs by stacked a-Si/poly-Si gate and capping nitride |
2005-04-01 |
96 |
Effects of metallic contaminants on the electrical characteristics of ultrathin gate oxides |
2005-01-01 |
97 |
Localized lateral growth of single-walled carbon nanotubes for field-effect transistors by a cobalt-mix-TEOS method |
2005-01-01 |
98 |
CoTiO3 high-kappa, dielectrics on HSG for DRAM applications |
2004-12-01 |
99 |
Suppression of boron penetration in P+-poly-SiGe gate p-channel metal-oxide-semiconductor field-effect transistor using NH3-nitrided and N2O-grown gate oxides |
2004-11-01 |
100 |
Suppression of the floating-body effect in poly-Si thin-film transistors with self-aligned Schottky barrier source and ohmic body contact structure |
2004-09-01 |
101 |
Mobility enhancement of MOSFETs on p-silicon (111) with in situ HF-Vapor. pre-gate oxide cleaning |
2004-09-01 |
102 |
Novel one-step aqueous solutions to replace pregate oxide cleans |
2004-08-01 |
103 |
Hot carrier degradations of dynamic threshold silicon on insulator p-type metal-oxide-semiconductor field effect transistors |
2004-04-01 |
104 |
High-voltage and high-temperature applications of DTMOS with reverse Schottky barrier on substrate contacts |
2004-02-01 |
105 |
Simultaneous quality improvement of tunneling- and interpoly-oxides of nonvolatile memory devices by NH3 and N2O nitridation |
2003-11-01 |
106 |
The effects of dielectric type and thickness on the characteristics of dynamic threshold metal oxide semiconductor transistors |
2003-09-01 |
107 |
A one-step single-cleaning solution for CMOS processes |
2003-09-01 |
108 |
Ultrathin zirconium silicate films deposited on Si(100) using Zr(O(i)-Pr)(2)(thd)(2), Si(O(t)-Bu)(2)(thd)(2), and nitric oxide |
2003-07-01 |
109 |
Structure and thermal stability of MOCVD ZrO2 films on Si (100) |
2003-04-01 |
110 |
Effect of CF4 plasma pretreatment on low temperature oxides |
2002-12-01 |
111 |
Impacts of gate structure on dynamic threshold SOI nMOSFETs |
2002-08-01 |
112 |
Improvement of low-temperature gate dielectric formed in N2O plasma by an additional CF4 pretreatment process |
2002-07-01 |
113 |
Ultra-shallow junction formation using implantation through capping nitride layer on source/drain extension |
2002-07-01 |
114 |
Physical and electrical characterization of ZrO(2) gate insulators deposited on Si(100) using Zr(O(i)-Pr)(2)(thd)(2) and O(2) |
2002-06-01 |
115 |
Performance evaluation of cleaning solutions enhanced with tetraalkylammonium hydroxide substituents for post-CMP cleaning on poly-Si film |
2002-06-01 |
116 |
Performance improvement of nickel salicided n-type metal oxide semiconductor field effect transistors by nitrogen implantation |
2002-04-01 |
117 |
Reduction of nickel-silicided junction leakage by nitrogen ion implantation |
2002-02-01 |
118 |
A practical implementation of parallel dynamic load balancing for adaptive computing in VLSI device simulation |
2002-01-01 |
119 |
Nitrogen implantation and in situ HF vapor clean for deep submicrometer n-MOSFETs |
2002-01-01 |
120 |
Comparison of novel cleaning solutions, with various chelating agents for post-CMP cleaning on poly-Si film |
2001-11-01 |
121 |
Electrical characteristics of thin cerium oxide film on silicon substrate by reactive DC sputtering |
2001-09-01 |
122 |
Improved low temperature characteristics of p-channel MOSFETs with Si1-xGex raised source and drain |
2001-08-01 |
123 |
High quality interpoly dielectrics deposited on the nitrided-polysilicon for nonvolatile memory devices |
2001-07-01 |
124 |
X-ray photoelectron spectroscopy of gate-quality silicon oxynitride films produced by annealing plasma-nitrided Si(100) in nitrous oxide |
2001-07-01 |
125 |
One-step cleaning solution to replace the conventional RCA two-step cleaning recipe for pregate oxide cleaning |
2001-06-01 |
126 |
Electrical properties of shallow p(+)-n junction using boron-doped Si1-xGex layer deposited by ultrahigh vacuum chemical molecular epitaxy |
2001-05-01 |
127 |
Characterization of ultrathin oxynitride (18-21 angstrom) gate dielectrics by NH3 nitridation and N2O RTA treatment |
2001-05-01 |
128 |
Comparison of ultrathin CoTiO3 and NiTiO3 high-k gate dielectrics |
2001-03-15 |
129 |
High-k cobalt-titanium oxide dielectrics formed by oxidation of sputtered Co/Ti or Ti/Co films |
2001-03-05 |
130 |
Nano-oxidation of silicon nitride films with an atomic force microscope: Chemical mapping, kinetics, and applications |
2001-02-15 |
131 |
High quality interpoly-oxynitride grown by NH3 nitridation and N2O RTA treatment |
2001-02-01 |
132 |
The effects of super-steep-retrograde indium channel profile on deep submicron n-channel metal-oxide-semiconductor field-effect transistor |
2001-01-01 |
133 |
High-performance and high-reliability 80-nm gate-length DTMOS with indium super steep retrograde channel |
2000-12-01 |
134 |
Characteristics of TEOS polysilicon oxides: Improvement by CMP and high temperature RTA N-2/N2O annealing |
2000-11-01 |
135 |
Optimum conditions for novel one-step cleaning method for pre-gate oxide cleaning using robust design methodology |
2000-10-01 |
136 |
High quality ultrathin CoTiO3 high-k gate dielectrics |
2000-09-01 |
137 |
Reduced reverse narrow channel effect in thin SOI nMOSFETs |
2000-09-01 |
138 |
An anomalous crossover in Vth roll-off for indium-doped nMOSFETs |
2000-09-01 |
139 |
Plasma-process-induced damage in sputtered TiN metal-gate capacitors with ultrathin nitrided oxides |
2000-08-01 |
140 |
Characteristics of polysilicon oxides combining N2O nitridation and CMP processes |
2000-08-01 |
141 |
Robust ultrathin oxynitride dielectrics by NH3 nitridation and N2O RTA treatment |
2000-08-01 |
142 |
Plasma-induced charging damage in ultrathin (3-nm) gate oxides |
2000-07-01 |
143 |
Novel cleaning solutions for polysilicon film post chemical mechanical polishing |
2000-07-01 |
144 |
Improvement of polysilicon oxide integrity using NF3-annealing |
2000-06-15 |
145 |
Low contact resistance of poly-plug structure by in-situ HF-vapour cleaning |
2000-04-13 |
146 |
High performance 0.1 mu m dynamic threshold MOSFET using indium channel implantation |
2000-03-01 |
147 |
Nanometer-scale conversion of Si3N4 to SiOx |
2000-01-17 |
148 |
The combined effects of nitrogen implantation at S/D extension and N2O oxide on 0.18 mu m N- and P-metal oxide field effect transistors (MOSFETs) |
1999-12-01 |
149 |
Improvement of junction leakage of nickel silicided junction by a Ti-capping layer |
1999-11-01 |
150 |
A novel Si-B diffusion source for p(+)-poly-Si gate |
1999-10-01 |
151 |
A comprehensive study of hot carrier stress-induced drain leakage current degradation in thin-oxide n-MOSFET's |
1999-09-01 |
152 |
Enhancement of integrity of polysilicon oxide by using a combination of N2O nitridation and CMP process |
1999-05-01 |
153 |
The effects of shallow germanium halo doping on N-channel metal oxide semiconductor field effect transistors |
1999-01-15 |
154 |
Improvement of reliability of metal-oxide semiconductor field-effect transistors with N2O nitrided gate oxide and N2O polysilicon gate reoxidation |
1998-10-01 |
155 |
Improving radiation hardness of EEPROM/flash cell by N2O annealing |
1998-07-01 |
156 |
Characterization of polysilicon oxides thermally grown and deposited on the polished polysilicon films |
1998-04-01 |
157 |
Evaluation of plasma charging damage in ultrathin gate oxides |
1998-03-01 |
158 |
Effects of N2O-annealed sacrificial oxide on the short-channel effects of nMOSFETs |
1998-02-19 |
159 |
Suppression of boron penetration in p(+) polysilicon gate using Si-B diffusion source |
1998-01-08 |
160 |
A study on the radiation hardness of flash cell with horn-shaped floating-gate |
1997-09-01 |
161 |
Effects of floating-gate doping concentration on flash cell performance |
1997-08-01 |
162 |
Improved flash cell performance by N2O annealing of interpoly oxide |
1997-07-01 |
163 |
Suppression of boron penetration by using inductive-coupling-nitrogen-plasma in stacked amorphous/polysilicon gate structure |
1997-06-19 |
164 |
A novel planarization of oxide-filled shallow-trench isolation |
1997-01-01 |
165 |
Suppression of boron penetration in BF2+-implanted poly-Si gate |
1996-12-01 |
166 |
Mechanism of nitrogen coimplant for suppressing boron penetration in p(+)-polycrystalline silicon gate of p metal-oxide semiconductor field effect transistor |
1996-09-16 |
167 |
Nitridization of the stacked poly-Si gate to suppress the boron penetration in pMOS |
1996-07-01 |
168 |
POST-POLYSILICON GATE-PROCESS-INDUCED DEGRADATION ON THIN GATE OXIDE |
1995-11-01 |
169 |
ELLIPSOMETRIC MEASUREMENTS AND ITS ALIGNMENT - USING THE INTENSITY RATIO TECHNIQUE |
1995-09-01 |
170 |
EFFECTS OF POSTETCHING TREATMENTS ON ELECTRICAL CHARACTERISTICS OF THERMAL OXIDES ON REACTIVE-ION-ETCHED SILICON SUBSTRATES |
1995-09-01 |
171 |
NITRIDATION OF THE STACKED POLY-SI GATE TO SUPPRESS THE BORON PENETRATION IN PMOS |
1995-06-01 |
172 |
IMPROVEMENT OF THIN OXIDES THERMALLY GROWN ON THE REACTIVE-ION-ETCHED SILICON SUBSTRATES |
1995-05-01 |
173 |
FOURIER-TRANSFORM INFRARED SPECTROSCOPIC STUDY OF OXIDE-FILMS GROWN IN PURE N2O |
1995-05-01 |
174 |
THIN POLYOXIDE ON THE TOP OF POLY-SI GATE TO SUPPRESS BORON PENETRATION FOR PMOS |
1995-05-01 |
175 |
INHIBITION OF BIRDS BEAK IN LOCOS BY NEW BUFFER N2O OXIDE |
1995-02-16 |
176 |
MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY MEASUREMENT ON LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITED AMORPHOUS-SILICON AND POLYSILICON |
1994-08-01 |
177 |
MEASUREMENT OF THIN OXIDE-FILMS ON IMPLANTED SI-SUBSTRATE BY ELLIPSOMETRY |
1994-04-01 |
178 |
CHARACTERIZATIONS OF OXIDE GROWN BY N2O |
1993-10-01 |
179 |
CHARACTERIZATION OF SEMIINSULATING POLYCRYSTALLINE SILICON PREPARED BY LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITION |
1993-09-01 |
180 |
THICKNESS DETERMINATION OF POLY-SI/POLY-OXIDE POLY-SI/SIO2/SI STRUCTURE BY ELLIPSOMETER |
1993-06-24 |
181 |
THE REFRACTIVE-INDEX OF INP AND ITS OXIDE MEASURED BY MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY |
1993-05-15 |
182 |
A STUDY OF THE INTERFACIAL LAYER OF AL AND AL(1-PERCENT SI)-SI CONTACTS USING A ZERO-LAYER ELLIPSOMETRY MODEL |
1992-11-01 |
183 |
POLY-OXIDE POLY-SI/SIO2/SI STRUCTURE FOR ELLIPSOMETRY MEASUREMENT |
1992-06-04 |
184 |
MEASUREMENT OF ULTRATHIN (LESS-THAN-100-A) OXIDE-FILMS BY MULTIPLE-ANGLE INCIDENT ELLIPSOMETRY |
1991-06-01 |
185 |
ELLIPSOMETRY MEASUREMENT OF THE COMPLEX REFRACTIVE-INDEX AND THICKNESS OF POLYSILICON THIN-FILMS |
1990-02-01 |
186 |
Low-temperature poly-Si nanowire junctionless devices with gate-all-around TiN/Al2O3 stack structure using an implant-free technique |
1970-01-01 |