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蕭翔耀

蕭翔耀 Hsiao, Hsiang-Yao

電子郵件／E-mail：hhy0330@gmail.com

服務單位／Department：工學院 ／ 材料科學與工程學系

著作期間／Publish Period：2007-04-01 - 2014-10-01

著作統計／Statistics

Article（12）
Others（2）
Patents（4）
Proceedings Paper（2）
Thesis（2）

Article

序號
No.		 標題
Title		 著作日期
Date
1 Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
 2013-01-01
2 Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
 2012-10-01
3 Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
 2012-05-25
4 The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
 2012-05-01
5 Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
 2011-11-01
6 Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
 2010-10-01
7 Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
 2009-12-01
8 Thermomigration in Pb-free SnAg solder joint under alternating current stressing
 2009-03-02
9 INVESTIGATION OF JOULE HEATING EFFECT IN VARIOUS STAGES OF FAILURE IN FLIP-CHIP SOLDER JOINTS UNDER ACCELERATED ELECTROMIGRATION 2009-01-01
10 Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
 2008-08-01
11 Thermomigration in flip-chip SnPb solder joints under alternating current stressing
 2007-04-09
12 Temperature dependent responsivity of quantum dot infrared photodetectors
 2007-04-01

Others

序號
No.		 標題
Title		 著作日期
Date
1 Thermomigration in solder joints
 2012-09-01
2 Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
 2007-06-11

Patents

序號
No.		 標題
Title		 著作日期
Date
1 具有雙晶銅線路層之電路板及其製作方法
 2014-10-01
2 具有雙晶銅線路層之電路板及其製作方法
 2014-05-01
3 用於減緩介金屬化合物成長之方法
 2014-03-11
4 用於減緩介金屬化合物成長之方法
 2013-02-16

Proceedings Paper

序號
No.		 標題
Title		 著作日期
Date
1 Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
 2008-01-01
2 Measurement of Temperature Distribution in SnAg3.5 Flip-Chip Solder Joints during Current Stressing Using Infrared Microscopy
 2008-01-01

Thesis

序號
No.		 標題
Title		 著作日期
Date
1 探討失業率、物價及勞動生產力如何影響台灣的薪資水準 2014
2 覆晶銲錫接點在通電下焦耳熱效應及熱遷移之研究
 2009
工學院