Browsing by Author "Chan, KT"

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0.13 mu m low voltage logic based RF CMOS technology with 115GHz f(T) and 80GHz f(MAX)
(2003)
Guo, JC
;
Huang, CH
;
Chan, KT
;
Lien, WY
;
Wu, CM
Superior RF CMOS of 115GHz f(T) and 80GHz f(max) has been realized by 0.13mum low voltage logic based RF CMOS technology by aggressive device scaling and optimized layout. NFmin of 2.2dB at 10GHz is achieved even without deep N-well and ground-shielded signal pad. P,dB of near 10dBm can fit bluetooth requirement and 55% PAE at 2.4 GHz address the good potential of sub-100nm CMOS for low voltage RF power applications.
40-GHz coplanar waveguide bandpass filters on silicon substrate
(2002-11-01)
Chan, KT
;
Chen, CY
;
Chin, A
;
Hsieh, JC
;
Liu, J
We report a very simple process to fabricate high performance filter on Si at 40 GHz; using proton implantation. The filter has only -3.4-dB loss at peak transmission of 40 GHz; with a broad 9-GHz bandwidth. In sharp contrast, the filter on 1.5-mum SiO2 isolated Si has much worse transmission and reflection loss. This is the first demonstration of high performance filter at millimeter-wave regime on Si with process compatible to current VLSI technology.
Frequency-dependent capacitance reduction in high-k AlTiOx and Al2O3 gate dielectrics from IF to RF frequency range
(2002-04-01)
Chen, SB
;
Lai, CH
;
Chan, KT
;
Chin, A
;
Hsieh, JC
We have characterized the capacitance and loss tangent for high-k Al2O3 and AlTiOx gate dielectrics from IF (100 KHz) to RF (20 GHz) frequency range. Nearly the same rate of capacitance reduction as SiO2 was demonstrated individually by the proposed Al2O3 and AlTiOx gate dielectrics as frequency was increased. Moreover, both dielectrics preserve the higher k better than SiO2 from 100 KHz to 20 GHz. These results suggest that both Al2O3 and AlTiOx are suitable for next generation MOSFET application into RF frequency regime.
High-performance microwave coplanar bandpass and bandstop filters on Si substrates
(2003-09-01)
Chan, KT
;
Chin, A
;
Li, MF
;
Kwong, DL
;
McAlister, SP
High-performance bandpass and bandstop microwave coplanar filters, which operate from 22 to 91 GHz, have been fabricated on Si substrates. This was achieved using an optimized proton implantation process that converts the standard low-resistivity (similar to10 Omega (.) cm) Si to a semi-insulating state. The bandpass filters consist of coupled lines to form a series resonator, while the bandstop filter was designed in a double-folded short-end stub structure. For the bandpass filters at 40 and 91 GHz, low insertion loss was measured, close to electromagnetic simulation values. We also fabricated excellent bandstop filters with very low transmission loss of similar to1 dB and deep band rejection at both 22 and 50 GHz. The good filter performance was confirmed by the higher substrate impedance to ground, which was extracted from the well-matched S-parameter equivalent-circuit data.
Integrated antennas on Si with over 100 GHz performance, fabricated using an optimized proton implantation process
(2003-11-01)
Chan, KT
;
Chin, A
;
Lin, YD
;
Chang, CY
;
Zhu, CX
We have improved the performance of integrated antennas on Si for possible application in wireless communications and wireless interconnects. For practical VLSI integration, we have reduced the antenna size and optimized the proton implantation to a low energy of similar to 4 MeV with a depth of similar to 175 mum. To avoid any possible contamination, the ion implantation is applied after device fabrication. Excellent performance such as very low RF power loss up to 50 GHz, record high 103 GHz antenna resonance, and sharp 5 GHz bandwidth have been achieved.
Low RF loss and noise of transmission lines on Si substrates using an improved ion implantation process
(2003)
Chan, KT
;
Chin, A
;
McAlister, SP
;
Chang, CY
;
Tseng, C
Very low power loss less than or equal to 0.6 dB at 110 GHz and noise of < 0.25 dB at 18 GHz have been measured on transmission lines fabricated on Si substrates and implanted with proton. In contrast, much worse power loss of 5 dB and higher noise of 2.5 dB were measured without implantation. This large improvement arises from the high resistivity by proton implantation, which was also done after forming the transmission lines and at a reduced energy of similar to 4 MeV for easier process integration into current VLSI technology.
Microwave coplanar filters on Si substrates
(2003)
Chan, KT
;
Chin, A
;
Kuo, JT
;
Chang, CY
;
Duh, DS
High performance band-pass and band-stop microwave coplanar filters operating from 22 to 94 GHz have been realized on Si substrate using proton implantation process. Very good insertion loss and filter characteristics close to ideal E-M simulation are. measured that demonstrates the excellent filter performance to 91 GHz.
RF passive devices on Si with excellent performance close to ideal devices designed by electro-magnetic simulation
(2003)
Chin, A
;
Chan, KT
;
Huang, CH
;
Chen, C
;
Liang, V
High quality RF inductors, very low loss and noise CPW and microstrip lines, advanced broad and narrow band filters, and ring resonators have been achieved on Si substrates, using an optimized proton implantation process. The RF performance up to 100 GHz is close to that for ideal devices designed by EM simulation for lossless substrates.
The minimum noise figure and mechanism as scaling RF MOSFETs from 0.18 to 0.13 mu m technology nodes
(2003)
Huang, CH
;
Chan, KT
;
Chen, CY
;
Chin, A
;
Huang, GW
As scaling down the RF MOSFET from 0.18 to 0.13 mum technology nodes, the f(T) increases but the NFmin becomes worse by increasing similar to0.2 dB. A small NFmin of 0.93 dB is measured at 5.8 GHz in 0.18 mum MOSFET using 50 fingers but increases as either increasing or decreasing finger number. This abnormal dependence and higher noise at 0.13 mum is accurately analyzed by equivalent circuit model and due to the combined gate resistance and substrate effect.
The strong degradation of 30 angstrom gate oxide integrity contaminated by copper
(2001-04-01)
Lin, YH
;
Chen, YC
;
Chan, KT
;
Pan, FM
;
Hsieh, IJ
A much higher leakage current, a lower breakdown effective field, a poorer charge-to-breakdown, and worse stress-induced leakage current are observed in ultrathin 30 Angstrom oxides even at a low Cu contamination of 10 ppb. The strong degradation of the ultrathin gate oxide integrity can be explained by the tunneling barrier lowering and the increased interface trap tunneling due to the presence of Cu in the oxide and at the oxide-Si interface. (C) 2001 The Electrochemical Society.
Transmission line noise from standard and proton-implanted Si
(2001)
Chan, KT
;
Chin, A
;
Kwei, CM
;
Shien, DT
;
Lin, WJ
We have measured the NF(min) of transmission lines on 10(6) ohm-cm proton implanted Si, Si-on-Quartz, and standard Si with top isolation oxide. Trransmission lines on proton implanted Si shows the lowest NF(min) of less than 0.2dB because of the low substrate loss due to the high resistivity. The proton implantation did not contribute to excess shot noise induced by carriers trapping and de-trapping because of the very small diffusion length to metal line.