Browsing by Author "Cheng, Y. T."

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A FLEXIBLE, NON-INTRUSIVE POWER SENSOR TAG FOR THE ELECTRICITY MONITORING OF TWO-WIRE HOUSEHOLD APPLIANCES
(2012)
Chen, Y. C.
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Hsu, W. H.
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Cheng, S. H.
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Cheng, Y. T.
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交大名義發表
This paper presents a flexible non-intrusive power sensor tag with good proximity for accurate electric current and voltage sensing on a typical SPT-2 18AWG zip-cord power line of household appliances. The current and voltage sensors are simultaneously fabricated on a 100 mu m-thick flexible PET substrate. For the design of a 50-turns coil combing with two sensing electrodes in an area of 1.3x1cm(2), the sensor tag exhibits a sensitivity of 31.1 mu V/A and 98.9mV/115V for detecting 60Hz electric current and voltage, respectively.
A LOW-POWER MILLIWATT ELECTROMAGNETIC MICROSPEAKER USING A PDMS MEMBRANE FOR HEARING AIDS APPLICATION
(2011)
Chen, Y. C.
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Cheng, Y. T.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
This paper demonstrates a low-power electromagnetic microspeaker with a PDMS membrane for hearing aids application. For a 1.76mW power input, the speaker with a 3.5mm in diameter and 3.3 mu m thick membrane can generate a sound with the sound pressure level (SPL) of 106dB @1kHz in a 2c.c. coupler.
A SUB-MW ELECTROMAGNETIC MICROSPEAKER WITH BASS ENHANCEMENT USING A PARYLENE/GRAPHENE/PARYLENE COMPOSITE MEMBRANE
(2018-01-01)
Jadhav, P. R.
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Cheng, Y. T.
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Fan, S. K.
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Liang, C. Y.
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電子工程學系及電子研究所
This paper demonstrates an ultra-low-power electromagnetic microspeaker where a parylene/graphene/parylene composite layer is employed as the speaker membrane for not only bass sound enhancement but also for power improvement. The speaker with a similar to 500 nm thin composite membrane in a size of 3.5 mm in diameter can exhibit a sound output of 104 dB sound pressure level (SPL) @ 670 Hz in a 2 c.c. coupler with an input power of 380 mu W. This composite membrane speaker with the least power consumption performance has shown its great potential for the Completely-in-the-Canal (CIC) hearing aids applications with better battery life.
Broadband flip-chip interconnects for millimeter-wave Si-carrier System-on-Package
(2007)
Li, Chun-Hsing
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Fu, Chang Tsung
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Chao, Tzu-Yuan
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Kuo, Chien-Nan
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Cheng, Y. T.
A flip-chip interconnect is proposed to achieve good electrical performance applicable to millimeter-wave applications. By Au-Au thermocompression technique, the transition structure provides continuity of characteristic impedance from the on-carrier CPW line to the on-chip microstrip tine, as well as smooth current flow. Parameter optimization further indicates that the tapered reference ground connection is insensitive to the frequency response. Characterization of the structure is conducted by the THUR-REFLECT-LINE (TRL) calibration technique to test the flip-chip interconnects up to 50GHz. Measurement results show that return loss is better than 15dB and insertion loss smaller than 1.7dB up to 50GHz. The broadband transition structure is suitable for high frequency application without any external matching network.
Design and fabrication of a microplatform for the proximity effect study of localized ELF-EMF on the growth of in vitro HeLa and PC-12 cells
(2010-12-01)
Chen, Y. C.
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Chen, C. C.
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Tu, W.
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Cheng, Y. T.
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Tseng, F. G.
This paper presents a platform technology with experimental results that show the scientists and biologists a way to rapidly investigate and analyze the biological effects of localized extremely low frequency (ELF) electromagnetic field (EMF) on living cells. The proximity effect of the localized ELF-EMF on living cells is revealed using the bio-compatible microplatform on which an on-glass inductive coil array, the source of the localized ELF-EMF in micro scale, is designed, fabricated and operated with a field strength of 1.2 +/- 0.1 mT at 60 Hz for cell culturing study. After a 72 h ELF-EMF exposure, HeLa (human cervical cancer) and PC-12 (rat pheochromocytoma) cells exhibit about 18.4% and 12.9% cell proliferation rate reduction, respectively. Furthermore, according to the presented dynamic model, the reduction of the proliferation can be attributed to the interference of signal transduction processes due to the tangential currents induced around the cells.
Design and fabrication of a microplatform for the proximity effect study of localized ELF-EMF on the growth of in vitro HeLa and PC-12 cells
(2010-12-01)
Chen, Y. C.
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Chen, C. C.
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Tu, W.
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Cheng, Y. T.
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Tseng, F. G.
This paper presents a platform technology with experimental results that show the scientists and biologists a way to rapidly investigate and analyze the biological effects of localized extremely low frequency (ELF) electromagnetic field (EMF) on living cells. The proximity effect of the localized ELF-EMF on living cells is revealed using the bio-compatible microplatform on which an on-glass inductive coil array, the source of the localized ELF-EMF in micro scale, is designed, fabricated and operated with a field strength of 1.2 +/- 0.1 mT at 60 Hz for cell culturing study. After a 72 h ELF-EMF exposure, HeLa (human cervical cancer) and PC-12 (rat pheochromocytoma) cells exhibit about 18.4% and 12.9% cell proliferation rate reduction, respectively. Furthermore, according to the presented dynamic model, the reduction of the proliferation can be attributed to the interference of signal transduction processes due to the tangential currents induced around the cells.
Development of a Flexible SU-8/PDMS-Based Antenna
(2011)
Lin, Chih-Peng
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Chang, Chieh-Hsiang
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Cheng, Y. T.
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Jou, Christina F.
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電信工程研究所
In this letter, a flexible SU-8/PDMS-based antenna has been demonstrated, not only targeting the wearable computing, but also fitting well in the RF system-on-package (RF SOP) applications. The characteristics of the proposed antenna fabricated on a flexible polymer substrate (SU-8/PDMS) with different bending angles have been successfully measured and characterized for the first time. The measured results have shown fairly good agreement with the simulation results. The measured bandwidth and maximum gain are 3% from 6.2 to 6.4 GHz and 2.17 dBi, respectively, when the antenna is flat. Moreover, related antenna fabrication process provides a practical approach to realize the flexible antenna for the portable wireless electronics applications.
Electrochemically Synthesized Nanocomposites for MEMS Device Performance Enhancement
(2018-01-01)
Chen, C. C.
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Cheng, Y. T.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
In this paper, a performance enhancement scheme of MEMS devices is presented based on the implementation of electrochemically synthesized nanocomposites including Ni-diamonds, Ni-CNTs, NiFe-AAO CoNiMnP AAO etc.. Via the incorporation of nano-sized materials, the matrix material as a part of devices structure can exhibit distinct physical characteristics resulting from composite and shape effects for better device performance. Owing to the process advantages of low temperature and high compatibility with wafer-level CMOS process, the cost-effective electrochemical process technology has shown its potential for various MEMS applications.
Electroplated Ni-CNT Nanocomposite for Micromechanical Resonator Applications
(2012-06-01)
Lee, Yi-Chia
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Li, Ming-Huang
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Cheng, Y. T.
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Hsu, Wensyang
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Li, Sheng-Shian
In this letter, electroplated Ni-CNT nanocomposite is synthesized and utilized as a structural material for micromechanical resonator fabrication. Pretreated by sulfate sodium dodecyl, carbon nanotubes (CNTs) disperse well in electrolyte and can be incorporated in an electroplated Ni film. Clamped-clamped beam resonators fabricated using the nanocomposite show similar to 27% resonant frequency enhancement (from 498.75 to 634.72 kHz). Meanwhile, the Q factors of 781 and 760 for Ni and Ni-CNT nanocomposite resonators, which are comparable with the prior art, indicate that the anchor loss could dominate the Q performance of the beam resonators.
ELECTROPLATING PROCESS OF NI-CNTS NANOCOMPOSITE FOR MEMS RESONATOR FABRICATION
(2011)
Lee, Yi-Chia
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Cheng, Y. T.
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Hsu, Wensyang
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機械工程學系
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Department of Mechanical Engineering
The paper presents an electroplating process for Ni-Carbon Nanotubes (CNTs) nanocomposite micro-resonator (or mu-resonator) fabrication. Two kinds of chemical treatments, H(2)SO(4)/H(2)O(2) and Sodium dodecyl sulfate (SDS) have been utilized for the surface modification of CNTs, respectively. The resonant frequency and Q factor of the SDS treated Ni-CNTs nanocomposite resonators are 30.65 kHz and 221, respectively. The values are higher than that of the one made of pure Ni and the H(2)SO(4)/H(2)O(2) mixture treated Ni-CNTs nanocomposite. They are 29.35 kHz, 190, and 30.35 kHz, 198, respectively. The experimental results indicate a better dispersion treatment on the CNTs in an electroplating bath could result in more incorporated CNTs in the Ni matrix and exhibit better improvement of device performance.
FOCUSED SOURCE FORMATION USING A MICRO DISC-LIKE PATCH ANTENNA ARRAY FOR THz CMOS TRANSCEIVER APPLICATIONS
(2017-01-01)
Lu, Yi-Xuan
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Hsu, Meng-Tse
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Cheng, Y. T.
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Li, Chun-Hsing
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Kuo, Chien-Nan
The paper presents a scheme to generate a focused THz source using a disc-like antenna array for THz CMOS-based transceiver application. The disk-like antenna array is fabricated by pressing a steel ball onto a flexible flat antenna array placed on a hollow silicon mold to form a hemispherical shell disk. Simulation results show that the receiving power from the center of the disc-like patch antenna array can improve the ratio of the receiving power to the incident one from 0.064 to 0.101 in comparison with that from the flat antenna array. About 1-2 dB receiving power difference measured experimentally has also validated the source focusing capability via the scheme.
Formation, Rolling, and Agglomeration of a Co Seed Droplet in Patterned Inverted Silicon Nano-Pyramid
(2009)
Chen, C. C.
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Hsu, Lun-Hao
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Cheng, Y. T.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
The paper presents upper and lower limitations of nominal radius of liquid drops for rolling along an inclination by considering specified dimensionless Bond number, gravitational force, and Gibbs free energy. The relations between the Bond number and Gibbs free energy are established in this paper to determine the region of nominal radius of seeding droplets and the conditions of rolling mechanism. Experimental results show nanometer sized Co seeds formed on a patterned nonwettable silicon inverted pyramid {111} surface under the specified conditions will roll down and then aggregate in the bottom of the inverted pyramid to form a singular seed, which is applicable for 1-D material growth control.
Gravity-assisted chemical vapor deposition of vertically aligned single-walled carbon nanotubes
(2007)
Yeh, C. M.
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Chen, M. Y.
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Gan, J.-Y.
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Hwang, J.
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Lin, C. D.
Temperature and CH4/H-2 ratio of gas-flow rates are the two factors that strongly affect the qualities of vertically aligned single-walled carbon nanotubes (SWCNTs) in gravity-assisted chemical vapor deposition (CVD). The qualities of SWCNTs and other carbon products grown by gravity-assisted CVD were characterized by scanning electron microscopy and Raman spectroscopy. At temperatures between 850 and 900 degrees C, SWCNTs of very good quality stand alone on the substrate. At other temperatures, nanofibers or irregular islands of carbon are present on the substrate. The CH4/H-2 ratio influences the quality of SWCNTs more abruptly than temperature. At low ratio, no carbon nanotube is formed. The window of CH4/H-2 ratio for the growth of vertically aligned SWCNTs ranges from 160:80 to 160:40. At a ratio higher than 160:40, multiwalled CNTs replace SWCNTs and become the dominant product. (C) 2007 The Electrochemical Society.
Gravity-Assisted Seeding Control for 1-D Material Growth
(2009-07-01)
Chen, C. C.
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Hsu, Lun-Hao
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Rern, Kai
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Cheng, Y. T.
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Hsieh, Yi-Fan
This letter presents a seeding control scheme by utilizing gravity force to form an agglomeration of molten Co seeds on a patterned inverted silicon nanopyramid. Nanometer sized molten Co seeds formed on a nonwettable inverted pyramid surface can roll along the inclination followed by aggregation to form a singular seed with the size depending on the pyramid size and the thickness of as-deposited Co film inside the pyramid. The proposed scheme allowing the formation of well-aligned catalytic seeds with manipulated size will promise the control growth of 1-D material for practical integrated microelectronic device fabrication.
Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application
(2011-03-01)
Chao, Tzu-Yuan
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Liang, Chia-Wei
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Cheng, Y. T.
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Kuo, Chien-Nan
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電子工程學系及電子研究所
This paper presents a low-cost heterogeneous integration technology combining the previously developed bumpless radio-frequency (RF) system-on-a-package scheme with a special surface cleaning process to assemble a complementary metal-oxide-semiconductor chip with an organic substrate (SU-8/polydimethylsiloxane) by low-temperature Au-Au thermocompressive bonds (< 200 degrees C) for flexible wireless microsystem fabrication. The RF performance of -15 dB return loss and -0.25 dB insertion loss at 40 GHz and above 6 MPa bonding strength of a microstrip-to-coplanar-waveguide interconnect transition between the chip and the substrate make the technology practical for flexible wireless microsystem integration.
Model to determine the self-resonant frequency of micromachined spiral inductors
(2006-09-04)
Chen, C. C.
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Lin, Cheng-De
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Cheng, Y. T.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
This letter presents an approach to characterize electron behaviors within polygonal micromachined spiral inductors in which self-resonance occurs. Combining with the concepts of anomalous dispersion, standing wave, and field scattering, the self-resonant frequency of the microinductors can be calculated by means of an associated analytical model. According to this model the self-resonant frequency (SRF) can be derived as the "free electron" frequency of the inductor material. Simulation and measurement results validate that the model can provide a satisfactory prediction to the SRF of polygonal micromachined spiral inductors. (c) 2006 American Institute of Physics.
Nano-roughening for reliable N/MEMS manufacture
(2006)
Yang, Chia-Yeh
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Cheng, Y. T.
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Hsu, W. S.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
This paper presents a nano-roughneneing technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening for NEMS hermetic encapsulation. The average roughnesses of silicon substarte before and after the modification are 0.4nm and 12.4nm respectively. The roughness increase can effectively provide more than 30% bonding strength enhancement and 8% leakage reduction.
Power consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocomposite
(2007-06-11)
Huang, Yu Wen
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Chao, Yuan
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Chen, C. C.
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Cheng, Y. T.
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電子工程學系及電子研究所
This letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 degrees C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement. (c) 2007 American Institute of Physics.
Size Scaling of Printed Microstructures Using a Lift-off Printing (LoP) Process
(2014-01-01)
Fu, Yu-Min
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Liang, Yen-Ju
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Cheng, Y. T.
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Wu, Pu-Wei
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材料科學與工程學系
Inkjet printing has been one of fascinating techniques for microfabrication owing to the characteristics of low manufacturing cost, low processing temperature, low material usage,. etc. [1, 2]. In this work, a Lift-off Printing (LoP) process combining conventional photolithography and inkjet printing processes is introduced to realize printed size-scalable silver microstructures with the line width of 5 up to 70 m and the resistivity of similar to 5.7 mu Omega.cm on a silicon substrate. In addition, an as-printed interdigitated capacitor with the electrode size and spacing of 10 mu m has been successfully demonstrated with a capacitance of 2.3 pF/mm(2)@10kHz.
Stacked pulse-electroplated CoNiMnP-AAO nanocomposite permanent magnets for MEMS
(2015-12-01)
Wu, P. R.
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Chao, T. Y.
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Cheng, Y. T.
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電子工程學系及電子研究所
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Department of Electronics Engineering and Institute of Electronics
The paper presents a CMOS compatible pulse-electroplating technique combined with a low temperature bonding process for the synthesis of CoNiMnP-AAO (anodic alumina oxide) nanocomposite films and the fabrication of stacked composite permanent magnets (PMs). The magnetic nanocomposite film exhibits the best characteristics of the coercivity of 2472 Oe, remanence of 4000 G, and (BH)(max) of 16.13 kJ m(-3), in the existing CoNiMnP systems. Meanwhile, a surface magnetic flux density of 9.2 mT generated by a 15-layer-stacked composite PM with a volume of 9 mm(3) has shown the potential for various magnetic microelectromechanical systems (MEMS) fabrication using the nanocomposite material.