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Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
1-Sep-1996Deposition properties of selective tungsten chemical vapor depositionYeh, WK; Chen, MC; Wang, PJ; Liu, LM; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-1996Enhanced metalorganic chemical vapor deposition titanium nitride film fabricated using tetrakis-dimethylamino-titanium for barrier metal application in sub-half-micron technologyWang, CK; Liu, LM; Liao, M; Cheng, HC; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Aug-1996Enhanced metalorganic chemical vapor deposition titanium nitride film fabricated using tetrakis-dimethylamino-titanium for barrier metal application in sub-half-micron technologyWang, CK; Liu, LM; Liao, M; Cheng, HC; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1996Optimization of PVD Ti/CVD TiN liner for 0.35 mu m tungsten plug technologyWang, CK; Liu, LM; Liao, DM; Smith, DC; Danek, M; 交大名義發表; 電子工程學系及電子研究所; National Chiao Tung University; Department of Electronics Engineering and Institute of Electronics
1-Dec-1995Selective tungsten CVD on submicron contact holeYeh, WK; Chen, MC; Wang, PJ; Liu, LM; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-1995Thermal stability of AlSiCu/W/n(+)p diodes with and without TiN barrier layerYeh, WK; Chen, MC; Wang, PJ; Liu, LM; Lin, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
Showing results 1 to 6 of 6