Browsing by Author Sun, Wei-Hao
Showing results 1 to 1 of 1
Issue Date | Title | Author(s) |
---|---|---|
1-Jan-2009 | A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film | Tang, Pao-Yun; Sun, Wei-Hao; Yang, Kei-Hsiung; 交大名義發表; National Chiao Tung University |