Browsing by Author Tsai, YP

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 10 of 10
Issue DateTitleAuthor(s)
2006Augmented stereo panoramasChen, CW; Chan, LW; Tsai, YP; Hung, YP; 資訊工程學系; Department of Computer Science
1-Jan-2005A Bayesian approach to video object segmentation via merging 3-D watershed volumesTsai, YP; Lai, CC; Hung, YP; Shih, ZC; 資訊工程學系; Department of Computer Science
1-Mar-2006Comparison between immersion-based and toboggan-based watershed image segmentationLin, YC; Tsai, YP; Hung, YP; Shih, ZC; 資訊工程學系; Department of Computer Science
1-Jan-2002Hierarchical feature-based volume morphingKe, HR; Tsai, YP; Shih, ZC; 資訊工程學系; Department of Computer Science
2006A method for calibrating a motorized object rigHuang, PH; Tsai, YP; Lo, WY; Shih, SW; Chen, CS; Hung, YP; 資訊工程學系; Department of Computer Science
1-Jun-2000A novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistanceChang, KM; Deng, IC; Tsai, YP; Wen, CY; Yeh, SJ; Wang, SW; Wang, JY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Sep-2004Real-time software method for preserving eye contact in video conferencingTsai, YP; Kao, CC; Hung, YP; Shih, ZC; 資訊工程學系; Department of Computer Science
1-Dec-1999Suppression of copper diffusion through barrier metal-free hydrogen silsesquioxane dielectrics by NH3 plasma treatmentChang, KM; Deng, IC; Yeh, SJ; Tsai, YP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2001Using NH3 plasma pretreatment to improve the characteristics of organic spin-on low-k materials for copper metallizationChang, KM; Tseng, MH; Deng, IC; Tsai, YP; Yeh, SJ; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-May-2000Using NH3 plasma treatment to improve the characteristics of hydrogen silsesquioxane for copper interconnection applicationChang, KM; Deng, IC; Yeh, SJ; Tsai, YP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics