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Issue DateTitleAuthor(s)
1-Oct-1990ANALYSIS OF A 2-DIMENSIONAL RADOME OF ARBITRARILY CURVED SURFACECHANG, JH; CHANG, KK; 交大名義發表; 電信工程研究所; National Chiao Tung University; Institute of Communications Engineering
1-Jun-1993METALLIZATION OF ALUMINUM NITRIDE SUBSTRATES BY ELECTROLESS COPPER PLATINGCHIOU, BS; CHANG, JH; DUH, JG; 電控工程研究所; Institute of Electrical and Control Engineering
1-Aug-1995METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATECHIOU, BS; CHANG, JH; DUH, JG; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Dec-1993MORPHOLOGY AND ADHESION STRENGTH IN ELECTROLESS CU METALLIZED ALN SUBSTRATECHANG, JH; DUH, JG; CHIOU, BS; 電控工程研究所; Institute of Electrical and Control Engineering
1992UNCERTAINTY ANALYSIS OF A COMPUTERIZED SEDIMENT TRANSPORT MODELCHANG, JH; TUNG, YK; YANG, JC; YEH, KC; 土木工程學系; Department of Civil Engineering
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