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1-一月-2010Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaN(x) on Adhesion with CopperChang, Chih-Chieh; Pan, Fu-Ming; Chen, Ching-Wen; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2010Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with CopperChang, Chih-Chieh; Pan, Fu-Ming; Chen, Ching-Wen; 材料科學與工程學系; Department of Materials Science and Engineering
2011In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper ElectroplatingChang, Chih-Chieh; Pan, Fu-Ming; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-2009Pore sealing of mesoporous silica low-k dielectrics by oxygen and argon plasma treatmentsChang, Chih-Chieh; Pan, Fu-Ming; Chen, Ching-Wen; 材料科學與工程學系; Department of Materials Science and Engineering
2010利用電漿輔助原子層氣相沉積法在多孔性超低介電薄膜製備銅導線擴散阻障層之研究張智傑; Chang, Chih-Chieh; 潘扶民; Pan, Fu-Ming; 材料科學與工程學系
2011商用沸石與其金屬改質吸附劑應用於二氧化碳溫室氣體捕獲之吸脫附效能比較研究張智傑; Chang, Chih-Chieh; 白曛綾; Bai, Hsun-Ling; 環境工程系所
顯示 1 到 6 筆資料，總共 6 筆