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公開日期標題作者
1-一月-2014Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump InterconnectionsHuang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H.; 材料科學與工程學系; Department of Materials Science and Engineering
2014Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigrationLin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih; 電機學院; College of Electrical and Computer Engineering
1-七月-2017Photocontrollable Probe Spatiotemporally Induces Neurotoxic Fibrillar Aggregates and Impairs Nucleocytoplasmic TraffickingHe, Ruei-Yu; Chao, Shu-Han; Tsai, Yu-Ju; Lee, Chi-Chang; Yu, Chu-Yi; Gao, Hua-De; Huang, Yung-An; Hwang, Eric; Lee, Hsien-Ming; Huang, Joseph Jen-Tse; 生物資訊及系統生物研究所; 分子醫學與生物工程研究所; Institude of Bioinformatics and Systems Biology; Institute of Molecular Medicine and Bioengineering
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