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公開日期標題作者
20153D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology NodesHu, Yu-Chen; Lin, Chun-Pin; Hsieh, Yu-Sheng; Chang, Nien-Shyang; Gallegos, Anthony J.; Souza, Terry; Chen, Wei-Chia; Sheu, Ming-Hwa; Chang, Chien-Chi; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2016An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing SystemHu, Yu-Chen; Lin, Chun-Pin; Chang, Hsiao-Chun; Yang, Yu-Tao; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2007Generalized MLP/BP-based MIMO DFEs for overcoming ISI and ACI in band-limited channelsHsu, Terng-Ren; Chen, Chi-Shi; Hsu, Terng-Yin; Lee, Chen-Yi; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017An Implantable 128-Channel Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable mu-Needle Array and Flexible InterposerHuang, Po-Tsang; Huang, Yu-Chieh; Wu, Shang-Lin; Hu, Yu-Chen; Lu, Ming-Wei; Sheng, Ting-Wei; Chang, Fung-Kai; Lin, Chun-Pin; Chang, Nien-Shang; Chen, Hung-Lieh; Chen, Chi-Shi; Duann, Jeng-Ren; Chiu, Tzai-Wen; Hwang, Wei; Chen, Kuan-Neng; Chuang, Ching-Te; Chiou, Jin-Chern; 生物科技學系; 電子工程學系及電子研究所; 電控工程研究所; 國際半導體學院; Department of Biological Science and Technology; Department of Electronics Engineering and Institute of Electronics; Institute of Electrical and Control Engineering; International College of Semiconductor Technology
1-十二月-2015A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology NodeHu, Yu-Chen; Lin, Chun-Pin; Chang, Yao-Jen; Chang, Nien-Shyang; Sheu, Ming-Hwa; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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