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1-十二月-20040.13-mu m RF CMOS and varactors performance optimization by multiple gate layoutsHo, CC; Kuo, CW; Chan, Y; Lien, WY; Guo, JC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2005The effect of In2O3 conductive coating on the luminescence and zeta potential of ZnS : Cu, Al phosphorsChang, CH; Chiou, BS; Chen, KS; Ho, CC; Ho, JC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2004Electromigration and integration aspects for the copper-SiLK systemTseng, HS; Chiou, BS; Wu, WF; Ho, CC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
11-七月-1997Face selectivity in the 1,3-dipolar cycloaddition reactions of benzonitrile oxide with 5-substituted adamantane-2-thiones and 2-methyleneadamantanesChung, WS; Tsai, TL; Ho, CC; Chiang, MYN; leNoble, WJ; 應用化學系; Department of Applied Chemistry
1-三月-1997Face selectivity in the photocycloaddition reactions of acrylonitrile to 5-substituted adamantan-2-ones and pyrolysis of the products to methyleneadamantanesChung, WS; Ho, CC; 交大名義發表; 應用化學系; National Chiao Tung University; Department of Applied Chemistry
24-二月-2006Mn,Cd-metallothionein-2: A room temperature magnetic proteanChang, CC; Lee, SF; Sun, KW; Ho, CC; Chen, YT; Chang, CH; Kan, LS; 生物科技學系; 應用化學系分子科學碩博班; 物理研究所; Department of Biological Science and Technology; Institute of Molecular science; Institute of Physics
7-二月-1997Photochemistry of acetone in the presence of exocyclic olefins: An unexpected competition between the photo-Conia and Paterno-Buchi reactionsChung, WS; Ho, CC; 應用化學系; Department of Applied Chemistry
7-二月-1997Photochemistry of acetone in the presence of exocyclic olefins: An unexpected competition between the photo-Conia and Paterno-Buchi reactionsChung, WS; Ho, CC; 交大名義發表; 應用化學系; National Chiao Tung University; Department of Applied Chemistry
1-三月-2006S-parameters-based high speed signal characterization of Al interconnect on low-k hydrogen silsesquioxane-Si substrateHo, CC; Chiou, BS; 電子工程學系及電子研究所; Innovative Packaging Research Center; Department of Electronics Engineering and Institute of Electronics; Innovative Packaging Research Center
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