瀏覽 的方式： 作者 Huang, Tai-Yuan
顯示 1 到 3 筆資料，總共 3 筆
| 公開日期 | 標題 | 作者 |
| 1-一月-2017 | Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration | Yang, Yu-Tao; Yu, Ting-Yang; Kuo, Shu-Chiao; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 1-九月-2017 | Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration | Yang, Yu-Tao; Chou, Tzu-Chieh; Yu, Ting-Yang; Chang, Yu-Wei; Huang, Tai-Yuan; Yang, Kai-Ming; Ko, Cheng-Ta; Chen, Yu-Hua; Tseng, Tzyy-Jang; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics |
| 2009 | 以氧化鈣摻雜氧化鋯層於單極性電阻轉態效應之研究 | 黃泰源; Huang, Tai-Yuan; 曾俊元; Tseng, Tseung-Yuen; 電子研究所 |
