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公開日期標題作者
25-九月-2004The annealing behavior of copper deposit electroplated in sulfuric acid bath with various concentrations of thioureaKao, YL; Tu, GC; Huang, CA; Chang, JH; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2006The effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pHKao, YL; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering
1-八月-2000Hard chromium plating on cold swaged Cr-Mo steel using rotating cylinder electrodeHuang, CA; Tu, GC; Liao, MC; Kao, YL; 材料科學與工程學系; Department of Materials Science and Engineering
2005Microstructural study of the effect of chloride ion on electroplating of copper in cupric sulfate-sulfuric acid bathKao, YL; Li, KC; Tu, GC; Huang, CA; 材料科學與工程學系; Department of Materials Science and Engineering
25-五月-2005A study on the hardness variation of alpha- and beta-pure titanium with different grain sizesKao, YL; Tu, GC; Huang, CA; Liu, TT; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 5 筆資料，總共 5 筆