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公開日期標題作者
1-一月-20183-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2017Heterogeneous Chip Power Delivery Modeling and Co-Synthesis for Practical 3DIC RealizationLiao, Wei-Hsun; Lin, Chang-Tzu; Fang, Sheng-Hsin; Huang, Chien-Chia; Chen, Hung-Ming; Kwai, Ding-Ming; Chou, Yung-Fa; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2013I-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICsPan, Chi-Wen; Lee, Yu-Min; Huang, Pei-Yu; Yang, Chi-Ping; Lin, Chang-Tzu; Lee, Chia-Hsin; Chou, Yung-Fa; Kwai, Ding-Ming; 電信工程研究所; Institute of Communications Engineering
1-一月-2014Improving Power Delivery Network Design by Practical MethodologiesHuang, Chia-Chi; Lin, Chang-Tzu; Liao, Wei-Syun; Lee, Chieh-Jui; Chen, Hung-Ming; Lee, Chia-Hsin; Kwai, Ding-Ming; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2006SRAM cell current in low leakage designKwai, Ding-Ming; Hsiao, Ching-Hua; Kuo, Chung-Ping; Chuang, Chi-Hsien; Hsu, Min-Chung; Chen, Yi-Chun; Sung, Yu-Ling; Pan, Hsien-Yu; Lee, Chia-Hsin; Chang, Meng-Fan; Chou, Yung-Fa; 交大名義發表; National Chiao Tung University
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