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公開日期標題作者
1-七月-2013Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder jointsLiang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S.; 材料科學與工程學系; Department of Materials Science and Engineering
四月-2016Electromigration in reduced-height solder joints with Cu pillarsChen, Ming-Yao; Liang, Y. C.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
15-二月-2012Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder jointsLiang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao; 材料科學與工程學系; Department of Materials Science and Engineering
9-九月-2011Pressure dependence of the electronic structure and spin state in Fe(1.01)Se superconductors probed by x-ray absorption and x-ray emission spectroscopyChen, J. M.; Haw, S. C.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Lu, K. T.; Liang, Y. C.; Lee, Y. C.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Yang, T. J.; 電子物理學系; Department of Electrophysics
9-九月-2011Pressure dependence of the electronic structure and spin state in Fe1.01Se superconductors probed by x-ray absorption and x-ray emission spectroscopyChen, J. M.; Haw, S. C.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Lu, K. T.; Liang, Y. C.; Lee, Y. C.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Yang, T. J.; 電子物理學系; Department of Electrophysics
21-十月-2010Pressure-dependent electronic structures in multiferroic DyMnO(3): A combined lifetime-broadening-suppressed x-ray absorption spectroscopy and ab initio electronic structure studyChen, J. M.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Huang, S. W.; Jeng, H. T.; Lu, K. T.; Chen, T. H.; Liang, Y. C.; Chen, S. W.; Chuang, W. T.; Sheu, H-S.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Lin, C. M.; Yang, T. J.; 電子物理學系; Department of Electrophysics
21-十月-2010Pressure-dependent electronic structures in multiferroic DyMnO3: A combined lifetime-broadening-suppressed x-ray absorption spectroscopy and ab initio electronic structure studyChen, J. M.; Lee, J. M.; Chou, T. L.; Chen, S. A.; Huang, S. W.; Jeng, H. T.; Lu, K. T.; Chen, T. H.; Liang, Y. C.; Chen, S. W.; Chuang, W. T.; Sheu, H-S.; Hiraoka, N.; Ishii, H.; Tsuei, K. D.; Huang, Eugene; Lin, C. M.; Yang, T. J.; 電子物理學系; Department of Electrophysics
2012Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon ReflowLiang, Y. C.; Chen, C.; Tu, K. N.; 材料科學與工程學系; Department of Materials Science and Engineering
21-九月-2013Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysisLin, C. K.; Tsao, Wei An; Liang, Y. C.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 9 筆資料，總共 9 筆