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公開日期標題作者
1-十一月-2001Comparison of novel cleaning solutions, with various chelating agents for post-CMP cleaning on poly-Si filmPan, TM; Lei, TF; Ko, FH; Chao, TS; Chiu, TH; Lee, YH; Lu, CP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-五月-2001Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copperChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2000Novel cleaning solutions for polysilicon film post chemical mechanical polishingPan, TM; Lei, TF; Chen, CC; Chao, TS; Liaw, MC; Yang, WL; Tsai, MS; Lu, CP; Chang, WH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-八月-2004Novel one-step aqueous solutions to replace pregate oxide cleansPan, TM; Lei, TF; Ko, FH; Chao, TS; Chin, TH; Lu, CP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2001One-step cleaning solution to replace the conventional RCA two-step cleaning recipe for pregate oxide cleaningPan, TM; Lei, TF; Chao, TS; Liaw, MC; Ko, FH; Lu, CP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十月-2000Optimum conditions for novel one-step cleaning method for pre-gate oxide cleaning using robust design methodologyPan, TM; Lei, TF; Chao, TS; Liaw, MC; Lu, CP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2002Performance evaluation of cleaning solutions enhanced with tetraalkylammonium hydroxide substituents for post-CMP cleaning on poly-Si filmPan, TM; Lei, TF; Ko, FH; Chao, TS; Liaw, MC; Lee, YH; Lu, CP; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-七月-2002Wetting effect on gap filling submicron damascene by an electrolyte free of levelersChang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP; 材料科學與工程學系; Department of Materials Science and Engineering