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1-一月-2020Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC ElectrodepositionLu, Tien-Lin; Shen, Yu-An; Wu, John A.; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
二月-2017Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigrationShen, Yu-An; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
1-二月-2019Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumpsShen, Yu-An; Ouyang, Fan-Yi; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2016Effect of Sn Grain Orientation on the Formation of Cu6Sn5 Intermetallic Compounds during ElectromigrationShen, Yu-An; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2015Study of Grain Size and Orientation of 30 mu m Solder Microbumps Bonded by Thermal CompressionShen, Yu-An; Chen, Chih; 材料科學與工程學系; Department of Materials Science and Engineering
2011利用滑動電弧的電漿輔助觸媒進行自熱反應重組乙醇的研究:不同觸媒的比較沈育安; Shen, Yu-An; 吳宗信; Wu, Jong-Shinn; 機械工程學系
2017錫的微結構對於錫銀微凸塊電遷移及熱遷移的影響沈育安; 陳智; Shen, Yu-An; Chen, Chih; 材料科學與工程學系所
顯示 1 到 7 筆資料，總共 7 筆