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20153D Heterogeneous Integration Structure Based on 40 nm- and 0.18 mu m- Technology NodesHu, Yu-Chen; Lin, Chun-Pin; Hsieh, Yu-Sheng; Chang, Nien-Shyang; Gallegos, Anthony J.; Souza, Terry; Chen, Wei-Chia; Sheu, Ming-Hwa; Chang, Chien-Chi; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2009A Micro-Network on Chip with 10-Gb/s Transmission LinkLiu, Wei-Chang; Lin, Chih-Hsien; Jou, Shyh-Jye; Lu, Hung-Wen; Su, Chau-Chin; Hong, Kai-Wei; Cheng, Kuo-Hsing; Yang, Shyue-Wen; Sheu, Ming-Hwa; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-十二月-2015A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology NodeHu, Yu-Chen; Lin, Chun-Pin; Chang, Yao-Jen; Chang, Nien-Shyang; Sheu, Ming-Hwa; Chen, Chi-Shi; Chen, Kuan-Neng; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
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