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公開日期標題作者
1-三月-2002Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurryHsu, JW; Chiu, SY; Tsai, MS; Dai, BT; Feng, MS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
15-十二月-2003Electron field emission from fluorinated amorphous carbon nanoparticles on porous aluminaLai, SH; Huang, KP; Pan, YM; Chen, YL; Chan, LH; Lin, P; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
15-九月-2000Field-emission properties of aligned carbon nanotubesHong, WK; Shih, HC; Tsai, SH; Shu, CT; Tarntair, FG; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-一月-2006Growth mechanism of laser annealing of nickel-induced lateral crystallized silicon filmsHu, GR; Wu, YS; Chao, CW; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
2004An integrated multichannel selection and dynamic power control scheme for IEEE.802.11 wireless ad hoc networksChung, J; Wang, KC; Shih, HC; 資訊工程學系; Department of Computer Science
1-五月-2002Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIIILin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-十一月-1997The microstructure of As precipitates in Si delta-doped GaAs grown by low-temperature molecular beam epitaxyHsieh, LZ; Huang, JH; Su, ZA; Guo, XJ; Shih, HC; Wu, MCY; 電子物理學系; Department of Electrophysics
1-十一月-1997The microstructure of As precipitates in Si delta-doped GaAs grown by low-temperature molecular beam epitaxyHsieh, LZ; Huang, JH; Su, ZA; Guo, XJ; Shih, HC; Wu, MCY; 電子物理學系; Department of Electrophysics
1-三月-2002The removal selectivity of titanium and aluminum in chemical mechanical planarizationHsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
16-六月-2003Role of extrinsic atoms on the morphology and field emission properties of carbon nanotubesChan, LH; Hong, KH; Xiao, DQ; Hsieh, WJ; Lai, SH; Shih, HC; Lin, TC; Shieu, FS; Chen, KJ; Cheng, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-九月-2002Simultaneous etching of polysilicon materials with different doping types by low-damage transformer-coupled plasma techniqueHung, CC; Lin, HC; Wang, MF; Huang, TY; Shih, HC; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-六月-2003Structure and electrical studies of fluorinated amorphous carbon films prepared by electron cyclotron resonance/chemical-vapor depositionHuang, KP; Lin, P; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-七月-2004Structures and properties of fluorinated amorphous carbon filmsHuang, KP; Lin, P; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1999A study on electrochemical metrologies for evaluating the removal selectivity of AlCMPChiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
10-五月-2006Trench gap-tilling copper by ion beam sputter depositionHan, S; Lee, TL; Yang, CJ; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
顯示 1 到 15 筆資料，總共 15 筆