瀏覽 的方式: 作者 Tseng, I-Hsiang

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5-五月-2012Effect of TiO2 on thermal and adhesive characteristics of poly(imide siloxane)/TiO2 hybrid filmsKo, Cheng-Jung; Tseng, I-Hsiang; Whang, Wha-Tzong; Tsai, Mei-Hui; 材料科學與工程學系; Department of Materials Science and Engineering
25-十一月-2012Enhancement of adhesion between copper foil and polyimide film containing thermally decomposable polystyrene particlesTsai, Mei-Hui; Huang, Yi-Chia; Tseng, I-Hsiang; Yu, Hsin-Pei; Lin, Yin-Kai; 材料科學與工程學系; Department of Materials Science and Engineering
1-六月-2013Holographic recording characteristics and physical mechanism of zinc methacrylate/nitroaniline-co-doped poly(methyl methacrylate)/9,10-phenanthrenequinone photopolymersKo, Cheng-Jung; Chen, Po-Lin; Hsiao, Yi-Nan; Lin, Shiuan-Huei; Whang, Wha-Tzong; Hsu, Ken Y.; Huang, Kuo-Jung; Chen, Chun-Chao; Tseng, I-Hsiang; Tsai, Mei-Hui; 材料科學與工程學系; 電子物理學系; 光電工程學系; Department of Materials Science and Engineering; Department of Electrophysics; Department of Photonics
18-十月-2013An in situ fabrication process for highly electrical conductive polyimide/MWCNT composite films using 2,6-diaminoanthraquinoneHuang, Yi-Chia; Lin, June-Hua; Tseng, I-Hsiang; Lo, An-Ya; Lo, Teng-Yuan; Yu, Hsin-Pei; Tsai, Mei-Hui; Whang, Wha-Tzong; Hsu, Ken-Yuh; 材料科學與工程學系; 光電工程學系; Department of Materials Science and Engineering; Department of Photonics
31-五月-2011Thermal and mechanical properties of polyimide/nano-silica hybrid filmsTsai, Mei-Hui; Huang, Yi-Chia; Tseng, I-Hsiang; Yu, Hsin-Pei; Lin, Yin-Kai; Huang, Shih-Liang; 材料科學與工程學系; Department of Materials Science and Engineering