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顯示 1 到 8 筆資料，總共 8 筆
公開日期標題作者
1-十一月-2001Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device applicationCheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK; 材料科學與工程學系; Department of Materials Science and Engineering
1-一月-2002Comment on "Generic universal switch blocks"Fan, HB; Wu, YL; Chang, YW; 資訊工程學系; Department of Computer Science
30-一月-2004Copper surface protection with a completely enclosed copper structure for a damascene processWang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW; 材料科學與工程學系; Department of Materials Science and Engineering
30-四月-2000Deformation and fracture of Al2O3/Al-Zn-Mg-Cu metal matrix composites at room and elevated temperaturesWu, YL; Chao, CG; 材料科學與工程學系; Department of Materials Science and Engineering
1-五月-2004Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxideCheng, YL; Wang, YL; Chen, HW; Lan, JL; Liu, CP; Wu, SA; Wu, YL; Lo, KY; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
15-一月-2004Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallizationCheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
30-一月-2004Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant materialCheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-十二月-2000Study the impact of liner thickness on the 0.18 mu m devices using low dielectric constant hydrogen silsesquioxane as the interlayer dielectricLan, JK; Wang, YL; Wu, YL; Liou, HC; Wang, JK; Chiu, SY; Cheng, YL; Feng, MS; 交大名義發表; National Chiao Tung University
顯示 1 到 8 筆資料，總共 8 筆